Step 0. Starting wafers

Step 0.	Process	Date	Operator
0.1	150 mm, p-type, <100>, 20-60 Ωcm, 635±25 um, TTV<7 um, B&W<35 um, double polished 15 wafers, NCH, PCH monitor wafers Split into 3 groups: W#1-5 ASML based 0.35 um CMOS process with LOCOS W#6-10 ASML based 0.35 um CMOS process with STI W#11-15 Mix&Match process with LOCOS	05/01/07	Pongarcz