Step 21B. Oxide liner growth

 

 

Step

 

Process

Date

Operator

 

21B.1

 

 

TLC clean Tystar2  2TLCA

2 hours of cleaning

 

08/09/07

Pongracz

 

21B.2

 

 

Std. clean wafers in Sink8 and then Sink6

Piranha clean

1/25 HF dip until NCH dewet (~ 2.5 min)

Include a test wafer

08/09/07

 

21.B

 

 

Dry oxidation in Tystar2          2DRYOXA

Target = 250A

1000 oC, 21 min.; N2 annealing 15 min

Measure oxide thickness with Nanospec

 

T

C

F

R

L

TEST

257

255

248

247

256

 

 

08/09/07