Step 23A. LOCOS oxidation

 

 

Step

 

Process

Date

Operator

 

23A.1

 

 

TLC clean Tystar2  2TLCA

2 hours of cleaning

 

08/15/07

Pongracz

 

23A.2

 

 

Std. clean wafers in Sink8 and then Sink6

Piranha clean

1/25 HF dip until dewet (~ 2.5 min)

Include NCH, PCH

08/15/07

 

23A.3

 

 

LOCOS oxidation in Tystar2          2WETOXA

Target = 5500A

1000 oC, 120 min.; N2 annealing 20 min

Measure oxide thickness with Nanoduv

 

T

C

F

R

L

NCH

5471

5586

5560

5527

5533

W#5

5438

5511

5485

5472

5430

W#11

5373

5418

5427

5381

5405

W#15

5435

5519

5530

5474

5466

 

 

08/16/07