Step 25. Sacrifical oxidation

 

 

Step

 

Process

Date

Operator

 

25.1

 

 

TLC clean Tystar2  2TLCA

2 hours of cleaning

 

08/17/07

Pongracz

 

25.2

 

 

Std. clean wafers in Sink6

Piranha clean

1/10 HF dip for 60 s

Include NCH, PCH

08/17/07

 

21.B

 

 

Dry oxidation in Tystar2          2DRYOXA

Target = 250A

900 oC, 40 min.; N2 annealing 1 s

Measure oxide thickness with Nanospec vs Nanoduv results

Nanospec

T

C

F

R

L

NCH

136

150

142

144

134

PCH

154

136

133

145

142

W#1

137

145

129

155

150

W#10

160

154

135

150

155

Nanoduv

T

C

F

R

L

NCH

212

224

232

235

224

PCH

221

233

231

230

230

W#1

225

230

236

232

229

W#10

225

240

237

239

231

 

 

08/20/07