Step 27A. N V_t implant photo on ASML W#1-10

Step	Process	Date	Operator
27A.1	Std. DUV litho. W#1-10 SVGCOAT6: 1,2,1 ASML: PWELL on CMOS180C reticle, -0.5 deg wafer rotation W#1, 10 23 mJ, -1 um W#2-9 20 mJ, 0 um SVGDEV6: 1,1,9 UVSCOPE UVBAKE, pr.J	08/21/07	Pongracz

Step 27B. N V_t photo on GCAWS6 W#11-15

Step	Process	Date	Operator
27B.1	Std. I-line litho. W#11-15 SVGCOAT6: 1,3,3 GCAWS6: PWELL reticle, MIXMATCH job, target coordinates at (-0.1129, 4.6982), dropout dies (2,6) (2,9) (7,2) (7,12) (14,6) (14,9) using global and local uDFAS alignment W#11 2.8s exposure time W#12 2.5s exposure time, underdeveloped, develop it twice W#13-15 2.6s exposure time Gobal alignement rejected multiple times before accepted SVGDEV6: 3,3,9 UVSCOPE UVBAKE, pr.J	08/21/07	Pongracz