Step 5. Mix&Match zero layer
Note: Target for global alignment and uDFAS marks will be etched in this step for GCAWS6 stepper
for Mix&Match process
|
Step 5.
|
Process |
Date |
Operator |
|
5.1
|
Std. DUV litho. SVGCOAT6: 1,2,1 ASML: Zero layer with COMBI2 on CMOS180D reticle, 30mJ, -0.4 um focus, -0.5 deg wafer rotation SVGDEV6: 1,1,9 UVSCOPE Note: EBR needed to be adjusted to remove right amount of resist from the wafer edge UVBAKE, pr.U |
05/10/07 |
Pongracz |