Final Report

6” Equipment Capability

Compatibility of Microlab Tools with 4" and 6" Substrates

√ Available CMOS Dedicated

quipment	Description	4"	6"
4ptprb	4-point resistivity probes	√	√
aln	AMS-2003 Aluminum nitride sputtering	√	NO*
amst	AMST Molecular Vapor Deposition	√	√
asiq	Tencor AS500 Profilometer	√	√
asml	ASM Lithography 5500/90 Stepper	NO	√
autoprobe	Electroglass Autoprobe wafer tester	√	√
cdsem	Hitachi S6780 CD-SEM	w pocket √	√
centura	Centura deep silicon etch (centura-dps)	NO	√
centura-mxp	Centura oxide etch chamber	NO	√
cmp	Strausbaugh CMP (tech required for chuck change)	√	√
cmpwc	SSEC Post CMP cleaner	√	√
cpa	CPA three-target sputterer	√	√
cpd	Critical Point Drying Apparatus	√	√
dektak	Dektak Surface Profilometer	√	√
disco	Disco DAD 2H/6 saw	√	√
dw	Davis & Wilder Evaporator	√	NO
edwards	Edwards Sputter System	√	√
edwardseb3	Edwards 306 E-Beam System	√	√
filmtek	Film Tek 2000, thin film measurement	√	√
flexus	Tencor Flexus FLX2320 Stress Gauge	√	√
gartek	Gartek sputterer	√	NO
gcaws2	GCA G-Line 10X wafer stepper	√	NO
gcaws6	GCA 8500 5X I-line wafer stepper	NO	√
heatpulse1	Heatpulse rapid thermal annealer for Si	√	NO
heatpulse2	Heatpulse rapid thermal annealer for GaAs	√	NO
heatpulse3	AG Heatpulse 610	√	√
heatpulse4	AG Heatpulse 610	√	√
hfvapor	Idonus 6' HF Vapor Etcher	√	√
hummer	Gold evaporator for cssem samples	√	NO
ionmill	Veeco ion mill	√	NO
irscope	Infrared Video Camera (wafer voids inspection)	√	√
iv	I-V probe station	√	√
jeol107	JEOL 6400 E-beam Writer	√	NO
kruss	Kruss Contact Angle Analyzer	√	√
ksaligner	Karl Suss Mask/Bond Aligner	√	√
ksba6	Karl Suss Bond Aligner	√	NO*
ksbonder	Karl Suss Wafer Bonder (tech required for chuck change)	√	√
lam1	Lam plasma etcher for nitride	√	√
lam2	Lam plasma etcher for SiO2	√	√
lam3	Lam 690 aluminum etcher	√	√
lam4	Lam Research Rainbow 4400 Poly-Si etcher	√	NO
lam5	Lam 9400 TCP Poly-Si Etcher	NO	√
leo	Leo Scanning Electron Microscope	√	√
matrix	Matrix 106 Resist Remover	√	√
memscope