Rev. No.
|
Date
|
Authors
|
Description of Revision
|
MOD 1 - Standard Wafer Cleaning
(Piranha Clean)
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 2 -
Standard Rinse – QDR & SRD
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 3 -
Standard Oxide Dip
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 4 -
Standard Dehydration Bake
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 5 -
Dehydration Bake or Anneal for Old Lab Processed Wafers
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 6 - Standard
Photoresist Coating Procedure
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 7 -
Standard Photoresist Development
|
|
00
01
02
|
9/07
4/09
8/09
|
S. Parsa
S. Parsa
L. Petho
|
Major re-write.
Changed LDD-26W to MF-26A (2
instances).
Reviewed. Minor editing throughout
the text.
|
|
MOD 8 - Standard
Hard Bake
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 9 -
Standard De-Scum Procedure
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 10 -
Photoresist Removal
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 11 - PRS-3000
Resist Stripping
|
|
00
01
|
8/07
8/07
8/09
|
W. Flounders
K. Chan
L. Petho
|
Deleted MOD 11 - Acetone Resist
Stripping
.Rewrite of the module.
Reviewed. Minor editing throughout
the text.
|
|
MOD 12 -
Plasma Ashing of Photoresist
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 13 - Wafer
Cleaning After Resist Removal
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 14 - Photoresist Stripping of
Hardened Resist
|
|
00
01
|
9/07
8/09
|
S. Parsa
L. Petho
|
Major re-write.
Reviewed. Minor editing throughout
the text.
|
|
MOD 15 - Standard Wet Oxide
Etching
|
|
|
|
|
|
|
MOD 16 - Plasma Etching in Technics-C
|
|
|
|
|
|
|
MOD 17 - Standard Furnace Cleaning
|
|
|
|
|
|
|
MOD 18 - Lift Off Process
|
|
00
01
|
10/07
5/08
|
M. Wasilik
M. Wasilik
|
Rewrite of the entire module.
Changes in the Procedures and Notes of G & I-Line
Bi-Layer Method.
|
|
MOD 19 - Spin-On SiO2 (SOG) for
Inter-Metal Dielectric
|
|
|
|
|
|
|
MOD 20 - Standard Wet Nitride
Etching
|
|
|
|
|
|
|
MOD 21 - Etching Single-Crystal
Silicon
|
|
|
|
|
|
|
MOD 22 - Plasma Etching of
Trenches in Single-Crystal Silicon
|
|
|
|
|
|
|
MOD 23 - Plasma Etching of Thick
PSG
|
|
|
|
|
|
|
MOD 24 - Contact Etching
|
|
|
|
|
|
|
MOD 25 - "Show" Wafer
Process
|
|
-
-
-
-
00
|
10/92
3/94
8/94
9/96
11/06
|
D.
Hebert
M.
Perez
K. Kis Halas
M.
Kushner
D. Bucher
|
N/A
N/A
N/A
N/A
Added 6” process; changed
exposure tool to ksaligner; updated exposure process.
|
MOD 26 - Lam
Monitors
|
|
00
|
9/95
|
M. Stagno
|
N/A |
MOD 27 - OCG Reversal Image
Process
|
|
00
01
|
3/88
11/97
|
K. Chan
K. Chan
|
N/A
N/A
|
MOD 28 - Polyimide Technology
|
00 01 |
2/88
11/97
|
T. Booth
K. Chan
|
N/A
N/A
|
MOD 29 - Standard Thick Resist Process (Shipley's
SPR-220 Thick Resist)
|
|
00
01
02
03
04
|
8/04
9/04
2/06
9/08
4/09
|
N.
Chen
M.
Wasilik
K.
Chan
M. Wasilik
S. Parsa
|
N/A
N/A
1) Microlab
does not offer STR-1075 photoresist anymore.
SPR 220 - 7.0 photoresist programs
are added on
svgcoat1.
2) Added
thick resist softbake condition.
N/A
Changed LD26W to MF-26A (2
instances).
|
MOD 30 - Standard Aluminum Wet Etch
|
|
00
|
10/99
|
S. Parsa
|
N/A |
MOD 31 - Processing Glass Wafers
|
|
00
01
02
03
04
05
|
8/00
7/02
5/05
2/06
2/07
10/08
|
S. Parsa
M. Young
M. Wasilik
W. Flounders, S. Parsa
W. Flounders
S. Parsa
|
N/A
N/A
N/A
Pyrex®
and Quartz Plasma Etch Definition Table added.
Added
Borofloat® 33 line in C) Glass
Properties table.
Added
Section VI - Dicing.
|
MOD 32 - Edge Bead Removal (EBR)
|
|
00
|
8/00
|
S. Parsa
|
N/A |
MOD 33 - Pocket Wafer Fabrication
for 6” Wafer
|
|
00
|
12//04
|
E. Kim
|
N/A
|
MOD 34 - Anodic Bonding
|
|
00
01
|
3/03
8/04
|
N.
Chen
E.
Kim, M.Wasilik
|
|
MOD 35 - Handle Bonding
(Reversible Bonding)
|
|
00
01
02
03
|
8/04
10/05
11/07
2/09
|
N.
Chen, M. Wasilik
M.
Wasilik
M. Wasilik
M. Wasilik
|
N/A
Additional note on Cool Greaseä in 1st
paragrah of I. Cool Greaseä as a
Bonding Agent.
Added Section IV. Revalpha Thermal Release Tape.
Added a flowchart and Section V. 4-inch Wafer Handle Bond for 6-inch
Through-Etch Processing
|
MOD 36 - Fusion Bonding
|
|
00
01
|
4/05
2/07
|
E. Kim
M. Wasilik
|
N/A
Added flow chart. |
|
MOD 37 - Standard Anti-Reflective
Coating for DUV Process
|
|
00
|
10/08
|
K. Chan, S. Parsa
|
New MOD defined for processing Bottom Anti-Reflective
Coating (BARC).
|
|
MOD 38 - ITO Deposition by
Reactive Thermal Evaporation
|
|
00
|
3/09
|
D. Queen
|
Initial write-up of new module.
|