Chapter 1.3 – Process Modules

Rev. No.

Date

Authors

Description of Revision

MOD 1 – MOD 14

00

9/07

S. Parsa

Major re-write.

MOD 11 - PRS-3000 Resist Stripping

 

00

8/07

8/07

W. Flounders

K. Chan

Deleted MOD 11 - Acetone Resist Stripping

.Rewrite of the module.

MOD 15

 

 

 

 

MOD 16

 

 

 

 

MOD 17

 

 

 

 

MOD 18

00

01

10/07

5/08

M. Wasilik

M. Wasilik

Rewrite of the entire module.

Changes in the Procedures and Notes of G & I-Line Bi-Layer Method.

MOD 19

 

 

 

 

MOD 20

 

 

 

 
 

MOD 21

 

 

 

 

MOD 22

 

 

 

 

MOD 23

 

 

 

 

MOD 24

 

 

 

 

MOD 25

-

-

-

-

00

10/92

3/94

 8/94

9/96

11/06

D. Hebert

M. Perez

 K. Kis Halas

M. Kushner

D. Bucher

N/A

N/A

N/A

N/A

Added 6” process; changed exposure tool to ksaligner; updated exposure process.

MOD 26

00

9/95

M. Stagno

 
N/A

MOD 27

00

01

3/88

11/97

K. Chan

K. Chan

N/A

N/A

MOD 28

 
00
01

2/88

11/97

T. Booth

K. Chan

N/A

N/A

MOD 29

00

01

02

03

8/04

9/04

2/06

2/06

N. Chen

M. Wasilik

K. Chan

K. Chan

N/A

N/A      

Microlab does not offer STR-1075 photoresist anymore.  SPR 220 - 7.0 photoresist programs are added on svgcoat1.

Added thick resist softbake condition.

MOD 30

00

10/99

S. Parsa

 
N/A

MOD 31

00

01

02

03

04

05

8/00

7/02

5/05

2/06

2/07

9/07

S. Parsa

M. Young

M. Wasilik

W. Flounders, S. Parsa

W. Flounders

S. Parsa

N/A

N/A

N/A

Pyrex® and Quartz Plasma Etch Definition Table added.

Added Borofloat® 33 line in C) Glass Properties table.

Minor changes

MOD 32

00

8/00

S. Parsa

 
N/A

MOD 33

00

12//04

E. Kim

N/A

MOD 34

00

01

3/03

8/04

N. Chen

E. Kim, M.Wasilik

N/A

N/A

MOD 35

00

01

02

8/04

10/05

11/07

N. Chen, M. Wasilik

M. Wasilik

M. Wasilik

N/A

Additional note on Cool Greaseä in 1st paragrah of I. Cool Greaseä as a Bonding Agent.

Added Chapter IV. Revalpha Thermal Release Tape.

MOD 36

00

01

4/05

2/07

E. Kim

M. Wasilik

N/A

Added flow chart.

5/08 – ML