Chapter 1 - General Information / Process Manual Chapters

Rev. No.

Date

Authors

Description of Revision

1.1      Table of Contents

N/A

2/07

M. Leullier

N/A

1.2      Microlab Safety Rules and Procedures (CHP)

00

01

02

03

04

05

06

 

07

08

 

09

10

 

11

12

13

6/01

5/03

6/04, 8/04

3/05

5/05

9/05

8/06

 

1/07

3/08

 

6/08

10/08

 

11/08

5/09

6/09

R. Hamilton

R. Hamilton

R. Hamilton

W. Flounders

R. Hamilton

R. Hamilton

R. Hamilton, W. Flounders

 

R. Hamilton

W. Founders

 

W. Flounders

R. Hamilton

 

R. Hamilton

M. Kushner

R. Hamilton

N/A

N/A

N/A

N/A

N/A

-  Updates on 6. Working Chemical Storage and e) Music Players.

-  Added link to new MSDS db available to UC researchers and staff. Minor addition in

   eyewear paragraph.under 5. Restrictions Note on Special Chemicals.

-  Added sentences in 5. Toxic Metals & Metal Dust on how to clean dust and debris.

-  Added a paragraph in Cryogens Section and changed “flammable and toxic vapors”

   to “volatile organic compounds” in 8. Chemical Disposal in Organic Solvents.

-  Added a paragraph about gloves in Personal Hygiene under Chemical Safety.

- Modified last sentence in Solutions paragraph (4. Working with Chemicals)

  to read strongest acid first.

- Added a Note in Chemical Safety in 1. Chemical Information and Reference Manuals.

- Modified paragraph on disposing empty bottles containing chemicals.

- Added note on Special Chemicals term.

1.3     Process  Modules (click here for details)

1.4      CMOS Process (4”, 1.3 µm)

01

1/01

L. Voros

N/A

1.5      CMOS Processes on 6” Wafers – 1.51  CMOS Process (1 µm)

00

01

5/02

8/05

J. Chang, S. Parsa

J. Chang

N/A

-  Added link to Process Monitoring/Furnaces. Modified cleaning procedure.

1.5      CMOS Processes on 6” Wafers – 1.52  CMOS Process (0.35 µm)

00

6/02

L. Voros, S. Parsa

N/A

1.6      Wafer and Substrate Specifications

00

01

02

03

1/01

11/04

9/05

8/08

K. Voros

S. Parsa

S. Parsa

L. Petho

N/A

N/A

N/A

-  Deleted Orientation paragraph in Section I. Corrected minor typos.

1.7      Material & Process Compatibility Policy

00

01

02

03

12/02

11/03

10/04

2/07

W. Flounders, S. Parsa

W. Flounders, S. Parsa

W. Flounders, S. Parsa

W. Flounders, S. Parsa

N/A

N/A

N/A

N/A

1.8      Compatibility of Microlab Tools with 4" and 6" Substrates

00

01

02

03

 

 

04

05

06

8/04

12/04

8/06

7/07

 

 

5/08

2/09

3/09

W. Flounders

K. Voros

W. Flounders

D. Queen

 

 

M. Leullier

W. Flounders

S. Parsa

N/A

N/A

-  Added hfvapor and vacoven. Revised all links.

1)       Randex is available for 6" sputtering but sputter etch is still limited to 4" wafers.

2)       The heatpulse4 has been added.

3)       Technics-a and technics-b have been removed.

-  Added ‘crestec’ E-Beam writer.

-  Modified entry for STS and Note at bottom of list.

-  Updated the list with additional tools and current information.

1.9      VLSI Etchants

00

01

02

1/04

 5/07

6/07

W. Flounders

W. Flounders

W. Flounders

N/A

-  Changed specs on Al etchant.

-  Added TMAH 90şC etchant.

1.10    Miscellaneous Etchants

00

01

02

10/03

12/06

4/09

S. Parsa

K. Voros

D. Queen

N/A

N/A

1)    Added Aqua Regia etchant.

2)    Fixed redundancy in etchants (Platinum).

3)    Modified Note in KOH (arectangular geometries possible with proper corner

       compensation).

4)    Added TMAH as a silicon etchant.

5)    Removed the cryptic last sentence in Tungsten.

1.11    Miscellaneous Plating Solutions

00

01

02

4/90

1206

4/09

K. Voros

K. Voros

D. Queen

N/A

N/A

Reviewed. No changes

1.13    How To Write a Lab Manual Chapter

00

01

 

02

10/03

4/07

 

6/07

S. Parsa

M. Leullier

 

K. Voros

N/A

-  Added info on Revision History in introduction and in Section 4.0 –

   Applicable Documents

-  Reviewed and shortened examples.

1.14    How To Print a Poster on the Plotter

00

01

7/04

7/07

M. Leullier

M. Leullier

N/A

-  Added Instructions for Producing Posters for SUPERB and some new links.

6/09 – ML