Chapter 1 - General Information / Process Manual Chapters

Rev. No.

Date

Authors

Description of Revision

1.1      Table of Contents

N/A

2/07

M. Leullier

N/A

1.2      Microlab Safety Rules and Procedures (CHP)

00

01

02

03

04

05

06

 

07

08

6/01

5/03

6/04, 8/04

3/05

5/05

9/05

8/06

 

1/07

3/08

R. Hamilton

R. Hamilton

R. Hamilton

W. Flounders

R. Hamilton

R. Hamilton

R. Hamilton, W. Flounders

 

R. Hamilton

W. Founders

N/A

N/A

N/A

N/A

N/A

Updates on 6. Working Chemical Storage and e) Music Players.

Added link to new MSDS db available to UC researchers and staff. Minor addition in eyewear paragraph.under 5. Restrictions Note on Special Chemicals.

Added sentences in 5. Toxic Metals & Metal Dust on how to clean dust and debris.

Added a paragraph in Cryogens Section and changed “flammable and toxic vapors” to “volatile organic compounds” in 8. Chemical Disposal in Organic Solvents.

1.3     Process  Modules (click here for details)

1.4      CMOS Process (4”, 1.3 µm)

01

1/01

L. Voros

N/A

1.5      CMOS Processes on 6” Wafers – 1.51  CMOS Process (1 µm)

00

01

5/02

8/05

J. Chang, S. Parsa

J. Chang

N/A

Added link to Process Monitoring/Furnaces. Modified cleaning procedure.

1.5      CMOS Processes on 6” Wafers – 1.52  CMOS Process (0.35 µm)

00

6/02

L. Voros, S. Parsa

N/A

1.6      Wafer and Substrate Specifications

00

01

02

1/01

11/04

9/05

K. Voros

S. Parsa

S. Parsa

N/A

N/A

N/A

1.7      Material & Process Compatibility Policy

00

 

01

02

03

12/02

 

11/03

10/04

2/07

W. Flounders,

S. Parsa

N/A

N/A

N/A

N/A

N/A

1.8      Compatibility of Microlab Tools with 4" and 6" Substrates

00

01

02

03

 

 

04

8/04

12/04

8/06

7/07

 

 

5/08

W. Flounders

K. Voros

W. Flounders

D. Queen

 

 

M. Leullier

N/A

N/A

Added hfvapor and vacoven. Revised all links.

1.       Randex is available for 6" sputtering but sputter etch is still limited to 4" wafers.

2.      The heatpulse4 has been added.

3.      Technics-a and technics-b have been removed.

Added ‘crestec’ E-Beam writer.

1.9      VLSI Etchants

00

01

02

1/04

 5/07

6/07

W. Flounders

W. Flounders

W. Flounders

N/A

Changed specs on Al etchant.

Added TMAH 90şC etchant.

1.10    Miscellaneous Etchants

00

01

10/03

12/06

S. Parsa

K. Voros

N/A

N/A

1.11    Miscellaneous Plating Solutions

00

01

4/90

1206

K. Voros

K. Voros

N/A

N/A

1.13    How To Write a Lab Manual Chapter

00

01

 

02

10/03

4/07

 

6/07

S. Parsa

M. Leullier

 

K. Voros

N/A

Added info on Revision History in introduction and in Section 4.0 – Applicable Documents

Reviewed and shortened examples.

1.14    How To Print a Poster on the Plotter

00

01

7/04

7/07

M. Leullier

M. Leullier

N/A

Added Instructions for Producing Posters for SUPERB and some new links.

5/08 – ML