Chapter 1 – General Information / Processing

1.1 Table of Contents

1.2 Chemical Hygiene Plan (Safety Rules & Procedures)

1.3 Process Modules

1.4 CMOS Process (4", 1.3 µm)

1.5 CMOS Processes on 6” Wafers:

1.51 CMOS Process (1 µm)

1.52 CMOS Process (0.35 µm)

1.6 Substrate Specifications and Wafer Identification

1.7 Material and Process Compatibility Policy

1.8 Compatibility of Microlab Tools with 4" and 6" Substrates

1.9 VLSI Etchants

1.10 Miscellaneous Etchants

1.11 Miscellaneous Plating Solutions

1.12 Material Safety Data Sheet (MSDS)

1.13 How to Write a Lab Manual Chapter

1.14 How to Print a Poster on the HP Plotter (being revised…)

1.15 Orientation Notes

1.16 Lab Guide