Chapter 2.5
Sink5 (Y2)
(sink5)
1.0
Title
Sink5
in the yellow room, Y2.
2.0
Purpose
This
document has specific information about wet sink5.
3.0
Scope
Wet
Sink5 provides both a quick soak and a long soak, PRS-3000
photoresist strip bath, as well as a pre-furnace metal clean bath, plus one DI
water rinse (QDR) followed by a quick dump. Each chemical bath and/or tank is
clearly labeled.
4.0
Applicable Documents
Revision
History
Chapter 2.3 of
the lab manual (Wet Sinks and Spin Dryers)
Chapter 2.1 of
the lab manual, which explains wafer boxes, tweezers, and other tool cleaning
prior to using VLSI sink.
5.0
Definitions & Process
Terminology
5.1
Full
Plenum Lockout Alarm: Early
warning alarm indicating sink drain failure.
5.2
Quick
dump rinse (QDR): DI water
fills the sink followed by a quick dump to get rid of the PRS-3000 residue.
5.3
Spin
Rinse Dryer (SRD): DI rinse
followed by dry cycle.
6.0
Safety
Never touch any surface while wearing
chemical-resistant gloves that other lab members may come into contact with,
such as the table tops, door handles, computer keyboards, face shields, aprons,
etc. If you need to step away from the sink at any time, rinse off gloves at
the glove wash, dry with techni-cloths, and put away in your drawer until you
are ready to resume your work at the sink.
Follow general safety guidelines for the
lab safety rules outlined in Chapter 2.3 and the following:
6.1
This sink contains two heated PRS-3000
photoresist baths as well as a heated pre-furnace metal cleaning bath;
therefore appropriate safety attire should be worn while working at this
station.
6.2
Do not adjust the heater controllers as
they have been preset to produce proper bath temperatures.
6.3
Only use
chemically resistance cassettes provided at the station (Teflon type); failure
to do so can cause damage to the station and/or compromise the operator’s
safety.
6.4
Dwyer
Photohelic Exhaust Flow Meter
(Figure 4): Monitors the sink exhaust flow and will shut down all electricity
and water to the sink if there is too much or too little flow. An alarm will
sound; press the red SILENCE button (Figure 3) and promptly report on
FAULTS.
6.5
MPC-901
Emergency Alarm (Figure 3):
Cuts power to the sink in emergencies. Push the big red STOP button (Figure
3) to cut the power to this sink. Report promptly on FAULTS.
6.6
6.7
The
flash point of PRS-3000 photoresist stripper is 90ºC. Please always keep
flammable material away from this sink.
6.8
Sink5
has an integrated fire suppression system which is tied to the lab and building
wide fire alarm system. Activation of the fire suppression system releases
large volumes of CO2 directly at the heated tanks and deck area of the sink.
Activation of the fire suppression system will activate the lab and building
wide fire alarm. Immediately evacuate the lab after activation of the Sink5
integrated fire suppression system.
7.0 Statistical/Process
Data
7.1
Please
refer to sink 5 enable message for the test data with PRS-3000 Photoresist
Stripper at 80ºC.
7.2
Warning: Any wafers
left in the “quick soak” bath longer than 20 minutes will be removed. Any
wafers left in the “long soak” bath more than 8 hours will be removed. When
there are wafers in the “long soak” bath without posting a note, the wafers
will be removed. This is to make the baths available for others to use. If you believe your process requires more
than 8 hours in the PRS-3000 Photoresist Stripper, please ask the process
supervisor for special permission.
8.0
Available Processes, Gases, Process
Two drainable PRS-3000 photoresist strip baths are available at this sink as well as a pre-furnace metal cleaning bath, plus one quick dump rinser (QDR) to properly clean the wafers prior to going into the spin rinse dryer 3.
|
|
Chemical |
Time |
Temperature |
|
Left-Heated |
PRS-3000 (quick soak) |
5 to 20 min. |
80ºC |
|
Center-Heated |
PRS-3000 (long soak) |
20 min. to 8 hours |
80ºC |
|
Right Heated |
Pre-Furnace Clean |
10 min. |
80ºC |
Note: When your
photoresist on your wafers does not strip off in 20 minutes at 80ºC, then this
PRS-3000 may not be the correct photoresist stripper for you.
9.0
Equipment Operation
The sink operation is relatively easy. The main difference between the old and new style VLSI sinks is that at the new sinks members invoke the dump rinse cycle from a keypad mounted on the face of the station.
9.1
Control Key Description
There are six control/displays at this station, see
Figures 1 and 2. The three MPC-100 (Figure 2) control panels are for the heated
baths: the one on the left is for the PRS-3000 (quick soak), the one in the
center for the PRS-3000 (long soak) and the one on the right is for the
pre-furnace metal cleaning bath. The MICROKLEEN RINSE (Figure 1)
control panel is for the quick dump rinse (QDR) station. The QDR is currently
set up for two dump rinse cycles. Wafers are initially showered with DI water
followed by two DI fill-dump cycles. These cycles end with wafers submerged in
the water for operator to extract and place them in SRD. See Figures &
Schematics for more details. The station performs an automatic self-cleaning,
every 60 minutes by one QDR cycle.
POWER Turns on the control panel.
START Begins a process cycle at any of
the control/display panels.
STOP/RESET Stops or interrupts a process cycle at any
time.
SAVE/SIL Silences the bath alarm.
HOLD Stops heating the PRS-3000
photoresist strip bath corresponding to the control/ display panels. Press HOLD
again or RETURN to reactivate the heater.
DRAIN Make sure chemicals baths are
sufficiently cooled down before draining. See Section 9.5.1 for the proper
draining procedure.
9.2
Quick Dump Rinse Operation
9.2.1
Place
wafers in the tank; it should initially be empty, if not, press OPEN to drain it.
Press START button to activate the dump rinse cycle (Figure 1). It will
cycle down from 2 to 1 then show 0 in the display window. At the end of the two
cycles a beeping alarm will sound. Press STOP/RESET to silence the
alarm. Upon completion of two rinse cycles remove wafers and place in SRD.
9.2.2
Note: To drain the
DI water, press OPEN. This will open the gate at the bottom of the sink.
Press STOP/RESET to close the gate after the water is drained.
9.3 Hot
9.4.1 Place your wafers in desired bath, either
the quick soak PRS-3000 bath, for 5 to 20 minutes, or the long soak
PRS-3000 bath for 20 minutes to 8 hours, or the metal cleaning bath for 10
minutes.
9.4.2 Press time/start button to start the strip
process cycle with the preset time and temperature (optional) (Figure 2).
9.4.3 When your strip (or clean) is completed after
the preset time, hit the TIME STOP/RESET button to reset the timer.
9.4.4
Remove
your wafers and rinse in quick dump rinse #1.
9.4
Draining Chemicals in Sink5 => HANDLED BY PROCESS STAFF ONLY
9.5
Adding Chemicals in Sink5 => Lab members are allowed to add more
PRS-3000 to the baths when the “L Level” warning indicator light is on.
9.5.1
PRS-3000
Photoreist Strip
9.5.1.1 Press the HOLD button once on
the MPC-100 temperature controller panel so that the bath temperature will cool
down to 60ºC. Note: LED light next to Heat, under status column,
goes off.
9.5.1.2 Next, flip the toggle switch from
“aspirate” to “spigot”. There is a separate toggle switch for each of the
tanks.
9.5.1.3 Next, open up the spigot on the bottom
left side of sink5. Be sure to have an empty PRS-3000 bottle positioned under
it to catch the draining liquid.
9.5.1.4 Each bath drain will fill 2-3 bottles.
Label each bottle “Used PRS-3000” and use one of the red and white ID stickers
that are on a roll on top of the Chemical Disposal cabinet in Rm. 432B.
9.5.1.5 Place the full labeled bottles into the
“Chemicals for Disposal” cabinet and be sure to fill out the manifest as well.
9.5.1.6 Use the deck hose to rinse out the
emptied bath; this also gets drained into the waste bottle.
9.5.1.7 Press DRAIN button again to
close the gate on the bottom of the tank. Fill the bath with fresh PRS-3000.
9.5.1.8 Press HOLD button to restart the
heater. LED adjacent to Heat, under status column, turns on.
9.6
Control Panel Programs are shown in the Appendix.
The parameter codes for the
programs on the MPC-100 temperature controllers and Microkleen Rinse are listed
on Tables 1 and 2 in the Appendix. The
parameter codes are not to be altered by the Microlab members. Please only use them as your reference check.
10.0
Troubleshooting Guidelines
9.3
Rinse
cycle stopped in the middle QDR cycles: press open to dump the water out. Press
stop/reset key followed by restart the dump rinse cycle from the start.
9.4
No
Power to Sink: Several issues can shut the system down.
9.4.1
Power
to System Off (Figure 3):
Press power ON if no issues have been reported on the Wand or if the system is
not under technician’s control.
9.4.2
Photohelic
Differential Pressure Reading
(Figure 4) is outside limits (two red bars): Consult with staff to check house
exhaust pressure.
9.4.3
Plenum
Full: The plenum on this system
is directly connected to fabwide (sink6). Full plenum in sink6 will also stop
sink5 operation.
Spin Rinse/DRYER HELP MESSAGES
|
HELP-0 Power
Failure
|
The
power failed while the unit was operating. Check the electrical lines in the
unit, and for a blown fuse. Press START to reset the microprocessor.
The rinser/dryer indexes the rotor and resets to the beginning of the
interrupted cycle. |
|
HELP-1 Bladder Pressure |
There
is inadequate nitrogen pressure to inflate the door seal. Check the door
bladder, the nitrogen pressure, and the pressure switch. Be sure there is
20-21 psi on RG2 and that the pressure switch turns off when the pressure
reaches 17-18 psi. |
|
HELP-2 Nitrogen Pres |
There
is insufficient pressure in the system nitrogen line. Check the nitrogen
pressure switch (PSW1). It should be set to approximately 13 psi. Check the
system line for leaks. Be sure that the pressure at RG1 is 23 psi dynamic.
Check the Clean Coil thermostat and reset if necessary. |
|
HELP-3 Door Open |
The
door is not completely closed. Check the door. If the door is properly
aligned, check the micro-switch actuating arm. |
|
HELP-4 Index Failure |
The
unit is not able to index the rotor. Check the rotor positioner. |
|
HELP-5 Excessive Speed |
The
rotor speed has exceeded 3400 RPM. Retry the cycle a few minutes. If the
problem persists, there is a hardware problem. Call maintenance or VERTEQ for
assistance. |
11.0
Figures & Schematics
Figure 1 –
Quick Dump Rinse (QDR)
Figure 2 – Hot
Figure 3 – Main System Power/Alarm Controller
Figure 4 –
Photohelic Differential Pressure Gauge
|
12.0
Appendix
|
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Table 1 - Sink5 MPC-100 Hot
Note: Do not change the
recipes. The factory set up codes will
be impacted.