Chapter 2 - Cleaning Procedures

2.1 General Cleaning Procedures

2.2 Tystar and Lam Wafer Preparation and Rework

2.3 Sink3 Operation

2.4 Sink 4 Operation

2.5 Sink 5 (Y2)

2.6 Sink 6 (MOS Clean)

2.7 Sink 7 (VLSI)

2.8 Sink 8 (Non-MOS Clean)

2.9 Sink9 and Spin Dryer Operation

2.10 Old Lab Sinks Operation (sink432C and black utility sink)

2.11 Sink 432A (Old Lab)

2.12 Sinkplate - Electroplating

2.13 Tousimis 815 Critical-Point Dryer (small samples)

2.14 Tousimis 915B Critical-Point Dryer