Revision History for Chapter 3

Revision History for Chapter 3 – Mask Making

Rev. No.

Date

Authors

Description of Revision

3.1 - Mask Generation Using CAD Software

N/A

6/88

6/92

7/94

1/95

11/97

12/97

10/01

7/05

7/07

3/08

R. Rudell

D. Hebert

R. Moroney

M. Kraitchman

P.C. Simpson

D. Mudie

L. Voros

A. Horvath

A. Pongracz

M. Leullier

N/A

Frequently Asked Questions

N/A

L-Edit Mask Making Manual

N/A

Mask Making for ASML Wafer Stepper (6”)

Mask Making for GCAWS6

Added subsections 2.3.5 and 2.3.6 for dxf2gds & gds2dxf conversions

Updated Section 2.4.1 (cifplot) to reflect the addition of the new plotter Designjet T1100 and some modified command lines.

3.2 - GCAWS2 Wafer Alignment Key Design Guide

7/05

3/08

S. Parsa

L. Petho

Complete rewrite of the manual; moved KIC instruction to end of the chapter.

Reviewed. Few slight modifications, no major updates.

3.3 - GCA 3600F Pattern Generator

2/96

2/06

8/07

8/08

2/09

M. Kushner

D. Queen

M. Kushner

N/A

A few changes in parameters

Added mask sizes in System Specifications section.

Complete re-write of the chapter to conform to the new format.

Added TQ entry in Section 8.4 (Operator Commands) and Section 9.14.

3.4 - APT Emulsion Mask Process

12/06

3/07

11/09

M. Kushner

Modified the Purpose and Scope sections and added few minor changes.

Modified the equipment operation and  mask develop process for clarity.

1) Section 6.0 Safety: Added note not to run the chemicals in the bottles down to the last drop.

2) Subsection 9.1.4: Added location of the techni-cloths in R1.

3) Subsection 9.1.5: Changed sentence to read that the rapid fixer holding tank level is checked on a regular basis by staff.

4) Subsection 9.2.5: Instruct to dump, rinse, and then refill water beakers whenever the water is discolored or has particles.

3.5 - APT Chrome Mask Process

12/99

7/02

3/07

7/07

11/09

M. Kushner

M. Kushner, T. Muniz

M. Kushner

Re-write of chapter in new format

N/A

New pram recipe switches and Operating Procedures

Added one line in Section 10.0 Troubleshooting Guidelines.

1) Added a note in Section 9.0 that if you try to run 2 programs at the same time the aptchrome will wait for you to deselect one of the programs.

2) Added a sentence in Section 9.2 that if the chemicals spray out in a thin stream, it means the nozzle is clogged and needs to be replaced and should be reported promptly on FAULTS.

3) Added a note in Subsection 9.3.8 that techni-cloths can be found in R1.

3.6 - Iron Oxide Masks Processing

3/04

5/05

6/07

11/09

M. Kushner

N/A

1) Modified Section 9.0 to describe new operating procedure at the aptchrome.

2) Added a line in Section 10.0 and Programs in Section 11.0.

1) Added a note in Section 3.0 that photoresist gets stripped from the mask as a final step.

2) Added information in Subsection 9.1.4 that if more than one program recipe is selected, the system will wait for you to deselect one of them before running.

3) Added a sentence in Section 9.2 that if a chemical sprays out in a thin stream, the nozzle needs to be replaced.

4) Added info in Subsection 9.2.5 where to find the techni-cloths in R1.

3.7 - Ultratech Mask Copier

4/95

4/00

4/04

5/07

M. Kushner

K. Chan

M. Kushner, D. Queen

N/A

Removed reference to 2" mask plates. Updated chrome intensity settings. Added 12.9 for the polarity of a chrome to iron oxide copy.

3.8 - CMOS Baseline Test Chip

6/05

3/08

A. Horvath

L. Petho

N/A

Few additions and corrections of links.

11/09 – ML