Chapter 4.01
SVG 8800 6” Coat and
Develop Tracks
(svgcoat6 and svgdev6)
SVGCOAT6 and SVGDEV6
SVG 8826 Operation Manual available in the Microlab Office.
5.1
Coat Track: First track (closest to operator) used for
prime/coat process steps.
5.2
Develop Track: Second track (furthest from operator) used for
develop process.
5.3
In-line Prime Station: First station on the coat track, capable of HMDS
prime.
5.4
Hot plates: There are total of four hot plates available on
these tracks that are used for prime, soft bake, post exposure-bake and
hard-bake process steps.
5.5
Chill Plates: process station following the hot plate designed to
cool the wafers.
5.6
Control Panels: Four control panels designed to receive input from
the operator.
5.7
Indexer Module: Cassette platforms used for wafer load and unload
operations.
5.8
Transport Arms: Arms transfer wafers between stations and/or indexer
stations.
5.9
Cybor Pump Control
Module: This module controls resist
volume, speed and suck back on all our resist lines.
Follow general safety
guidelines in the lab as well as the specific safety rules as per follows:
6.1
Do not operate the spin
coat station with the protection cover off.
6.2
Do not place your hand
in the path of track’s moving parts, robots and or indexer module. Never
operate the spin or develop modules without the cover.
6.3
Do not access the
electronic and high power supplies inside the machine.
7.1
Process monitor data on
the Microlab’s home page.
7.2
Problem and comment
section under the equipment section of the wand.
7.3
Equipment enable
message of the wand.
8.0
Available
Processes
8.1
Spin Coat Process: The SVG8800 only dispense Rohm Haas UV
210-0.6 Positive DUV Photoresist on six-inch wafers currently.
8.2
Develop Process: There are two types of developers available on
SVGDEV6 Track. One of these developers is designed to develop either DUV or I-line
photoresist.
8.3
Prime Process: The coat track supports the in-line prime operation
at its first station, and just before sending the wafers to spin coat
operation.
8.4
Bake Processes: There are total of four bake-stations available on this
tool including the one assigned to prime operation. All bake stations except
the hard bake can control the temperature within 0.1ºC from the set point.
8.5
Post
Exposure Bake is to activate the
photo-acid produced during the exposure and making them soluble to the
developer solution. Post-exposure bake and
hard bake process steps can be done on the developer track (Track2).
8.6 Hard Bake, controlled by the bottom
station in the rightmost display window (Figure 4) is not recommended for small
feature, due to possible reflow of the photoresist. UV bake should instead be
used (see Chapter 4.21- UVBAKE). This bake station is periodically used for
hard baking the bottom anti-reflective (BARC) material at elevated temperature
of 200ºC, in which case the developer station is bypassed.
Note: The hard
bake hotplate default setting is 50ºC.
Always return to 50ºC after it has been changed for your desire usage.
There are two tracks available on the SVG8800 system. The front track (closest to the operator) is designed to perform prime, spin-coat, and soft-bake operations. The back track is used for post exposure bake, develop and hard bake operations.
9.1
General Coat/Developer Operation
9.1.1
Enable the system
(svgcoat6 or svgdev) on the wand.
9.1.2
Verify that the power
to the system is ON.
9.1.3
Verify that desired SVG
track (coat or develop) is in AUTO mode. This can be checked on the pertinent
control panel (pads) in front of the machine, Figures 1-4 (Appendix 3). The LED
next to the word AUTO should be illuminated on the Manual-single-Auto
key (switch). If not, press this key to toggle through the other options
(SINGLE or MANUAL) until AUTO is selected.
9.1.4
Select your desired
process recipes by first entering your selected program number on the key pad,
followed by pressing program select key on the front display. Alternatively, press the PROGRAM SELECT
button on the control panel keyboard to toggle through the available programs
(1-9). When the COATER display is
selected successfully, an asterisk appears at the left of the COATER
display. When the OVEN display is
selected successfully, a plus sign appears at the left of the OVEN
display.
Note: There
are four separate display windows: the left two are for coat track, and the
right two display windows are for developer track (as shown in Figures 1-4). On
the second and the fourth display window (Figures 2 and 4), you can toggle
between the two using the STATION SELECT button on the control panel
keyboard. Make sure proper window is
activated before entering your desired recipe.
9.1.5
You will need to change
soft-bake or PEB temperature for non-standard programs. Ask a staff to help
you, if needed. Make sure to put the temperature back to the DUV photoresist
default setting, once done. The default
temperature setting for DUV photoresist is 130ºC.
9.1.6
Load an empty cassette
onto the receive indexer (right side for the coater track, and left side for
the developer track). Load the cassette containing your wafers on the send indexer
(opposite side from the receive indexer). Make sure that the cassettes are
properly seated on the indexers.
Note: The coater
track processes wafers from left to right (first track, closest to operator)
and the developer track operates in the opposite direction from right to left,
while facing the machine.
9.1.7
Press the start
button on both keypads, designated to each track. This prompts load and receive
indexers to go down until the send cassette senses a wafer. The wafer
will then be transported to the first station on the track (prime station for
the coater and post-exposure bake for the developer track.
Note: If the
receive cassette does not lower, remove the cassette and then replace it. Hit
START and the cassette should lower.
9.1.8
If necessary, press INDEX
RESET button once to bring the send indexers up (starting position) or twice
for the receive indexer to come up.
(Note that if you press the INDEX RESET button, you must lift the
cassettes completely off the elevator and then replace them in order to
proceed, i.e. for the cassette to go down.) These actions reset the send &
receive elevator and can help user to alleviate/resolve cassette indexer
problems.
9.2
Other Functions
on the Control Panel
Beside the switch
functions described above, i.e. Power, Start, Index Reset, Station Select and
Program Select; there are other useful functions, which are described below:
9.2.1
START INDEX: Depressing the Start Index once,
will return the Send indexer to top position. Receive indexer will not reset
until any wafer in process enters the receive cassette. Depressing the Start
Index twice, will return the Receive cassette to top position immediately
unless there is a wafer between the processing station and the receive
cassette. The Send cassette is unaffected.
9.2.2
(PRIME, OVEN, COATER, DEVELOPER) STOP: Ends
processing immediately. Pressing START will resume processing with the next
operation programmed.
9.2.3
TRANSFER STOP: Immediately stops all indexers
and transfer arms. Wafers in transit between stations will remain in place until
START command is given. Wafers in
process will complete processing and will come to the top position waiting for
the START command.
9.2.4
EVENT SELECT: Used to verify the sequence of
operations and associate parameters for the selected program. The events will
be shown in sequence, but depressing the number followed by the event select
key can also access a particular event.
9.2.5
WAFER LOST:
Allows the operator to resume wafer processing if a wafer is removed or
broken during processing or if a sensor fails to see a transfer. The key
is only functional when a wafer has not been received at its next station after
a 6 sec delay.
9.2.6
CLEAR: Used to resume processing when machine is
in programming, diagnostic or calibration mode. Used to turn off Wafer Lost
alarm.
9.2.7
DIAGNOSTIC SELECT: Used to access machine and
sensor state diagnostics. Machine State messages for the send indexer and
processing station will be displayed in the upper display window. Machine State
messages for the receive indexer are displayed in the lower display window.
Sensor State messages are displayed in the top display window only. See Section
4 for a listing of machine and sensor state codes.
9.3
SVGCOAT6 and SVGDEV6 Programs
There are several prime, coat, bake and develop programs are available
on these two tracks. The standard DUV resist process is based on the Rohm Haas
UV 210-0.6 DUV Positive Photoresist process.
Table 1 - HMDS
Prime Programs
|
Program (#) |
Bake/Prime
Temp. (ºC) |
Prime Time (sec.) |
Chill Time (sec.) |
|
*1 |
100 |
60 |
6 |
|
9 |
No Prime |
− |
− |
Table 2 - Spin
Coat Programs
|
Program (#) |
Resist Type |
Spin Speed (RPM) |
Nanoduv
Measurement Program 10 (RI) |
Thickness (Å) |
|
*1 |
Rohm Haas UV210
– 0.6 |
7000 |
1.56 |
~ 4200 |
|
*2 |
Rohm Haas UV210
– 0.6 |
1480 |
1.56 |
~ 9000 |
|
3 |
Reserved |
− |
− |
− |
|
8 |
AZ EBR – link
to program 1 to 3 |
600 |
− |
− |
|
9 |
No Coat |
− |
− |
− |
Table 3 – Soft
Bake Programs
|
Program (#) |
Bake Method |
Bake Temp. (ºC) |
Bake Time (sec.) |
Chill Time (sec.) |
|
*1 |
Proximity |
130 |
60 |
6 |
|
*2 |
Proximity |
130 |
60 |
6 |
|
3 |
Contact |
90 |
60 |
6 |
|
9 |
No Bake |
− |
− |
− |
Table 4 –
Post-Exposure Bake Programs
|
Program (#) |
Bake Method |
Bake Temp. (ºC) |
PEB Time (sec.) |
Chill Time (sec.) |
|
*1 |
Contact |
130 |
60 |
6 |
|
*2 |
Contact |
130 |
60 |
6 |
|
3 |
Contact |
90 |
60 |
6 |
|
9 |
No Bake |
− |
− |
− |
Table 5 - Develop
Programs
|
Program (#) |
Developer Type |
Develop Time (sec.) |
Temp. (ºC) |
|
*1 |
LDD-26W (Rohm
Haas) |
45 |
20 |
|
*2 |
LDD-26W (Rohm
Haas) |
45 |
20 |
|
3 |
OPD 4262
(Fujifilm) |
60 |
20 |
|
9 |
No Develop |
− |
− |
Note 1: Soft-Bake uses the proximity bake process
and Post-Exposure Bake uses the contact bake process for the DUV photoresist. The
gap of the proximity bake is about 100 mm.
Note 2: Developer temperature is at 20 ± 1ºC.
Note 3: Programs with an asterisk next to the
number are standard default programs.
10.0 Troubleshooting Guidelines
10.1 Robot arm problems:
Do not touch the robot arms, while they are in motion. This can damage the arms
or pinch your fingers, caused bodily harm to the operator.
10.2 Alarm on the
track: sensor condition is not satisfied before a certain time has elapsed,
then an alarm will sound. The alarm can be turned off by pressing the CLEAR key
on the control panel keyboard. The
machine state can then be checked using the diagnostics feature as per follows.
10.2.1
Press the diagnostic select key on the control
panel. The display will show the following prompt: SELECT MODE 1-2-3.
10.2.2
Press 1 to display the present machine state. The
machine state diagnostic messages
for the upstream indexers,
and processing stations are displayed
in the upper display window. Machine
state messages for the downstream sensors are displayed in the lower display
window.
10.2.3
The following table describes
the various machine
state messages and their meanings:
PURGE/EXHAUST
FAILURE:
Airflow used to purge motors of flammable vapors as a safety feature has been
interrupted. Also displayed if process exhaust flow is below minimum acceptable
level.
PURGE/EXH RESUMED
- START? Air purge pressure or process exhaust flow
is again within limits. Press START to resume operation.
SENDER CASSETTE? Designated cassette is no longer
detected.
RECEIVER
CASSETTE? By cassette micro
switch. Cassette has been dislodged or removed while in process. Replace
cassette on support.
SENDER STOP
- START? When the cassette has been placed.
RECEIVER STOP -
START? On the indexer platform properly, one
of these messages will be displayed, Press START to resume operation.
Note: Cassette can be dislodged if indexer wafer or
index sensor does not see wafer, causing indexer to drive past wafer.
CLEAR WAFER -
START? Power-up has been
performed with a wafer on the spindle chuck or chill plate: vacuum is turned on
momentarily at these locations to check for a wafer. If message is displayed,
remove wafer. If no wafer is present, the vacuum sensor needs to be reset to
properly detect wafers.
VACUUM BREAK - START? Vacuum detection of the wafer while it is o