Chapter 4.11
SVGCOAT 4” Photoresist Coat Tracks
(svgcoat1 and svgcoat2)
SVGCOAT1 and SVGCOAT2
SVG 8626PC/ 8636HPO Operation Manual available in the Microlab Office.
5.1
Coat Track 1: First track (closest to operator) used for coat
process steps.
5.2
Coat Track 2: Second track (furthest from operator) used for coat
process steps also.
5.3
Hot plates: There are total of two hot plates available on these
tracks that are used for soft-bake process steps.
5.4
Chill Plates: process station following the hot plate designed to
cool the wafers.
5.5
Control Panels: Two control panels designed to receive input from
the operator.
5.6
Indexer Module: Cassette platforms used for wafer load and unload
operations.
5.7
Transport: Belts transfer wafers between stations and/or
indexer stations.
5.8
Millipore Pump
Control Module: This module controls
resist volume, speed and suck back on all our resist lines.
Follow general safety
guidelines in the lab as well as the specific safety rules as per follows:
6.1
Do not operate the spin
coat station with the protection cover off.
6.2
Do not place your hand
in the path of track’s moving parts, robots and or indexer module. Never
operate the spin modules without the cover.
6.3
Do not access the
electronic and high power supplies inside the machine.
7.1
Process monitor data on
the Microlab home page.
7.2
Problem and comment
section under the equipment section of the wand.
7.3
Equipment enable
message of the wand.
7.4
Detail SPR 220 – 7.0
photoresist processing can be found on MOD 29.
7.5
Refractive index for
SPR 220 – 7.0 photoresist- 1.73 at 365 nm, 1.30 at 405 nm, 1.67 at 436 nm, 1.63
at 633 nm.
8.0
Available
Processes
8.1
Spin Coat Process: The SVG8626 can dispense three types of
photoresists on four-inch wafers. These are: FujiFilm OCG 825 (G-line resist),
OCG OiR 897-10i (I-line resist) and Rohm Haas SPR 220 (broadband resist) for
track 1 & 2.
8.2
Bake Processes: There is one bake-station available on each track.
The bake station can control the temperature within 0.1ºC from the set point.
8.3
Post-exposure bake and
hard bake process steps for I-line and G-line resists can be done on the
developer track (svgdev) if 120ºC is desired.
There are two tracks available on the SVG8626 system. The both tracks are designed to perform spin-coat and soft-bake operations.
9.1 General
Coat Operation
9.1.1
Enable the system (svgcoat1
or svgcoat2) on the wand.
9.1.2
Verify that the power
to the system is ON.
9.1.3
Verify that desired SVG
track (svgcoat1 or svgcoat2) is in AUTO mode. This can be checked on the
pertinent control panel (pads) in front of the machine, Figures
1-2 (Section 11). The LED next to the word AUTO should be
illuminated on the Manual-single-Auto key (switch). If not, press this
key to toggle through the other options (SINGLE or MANUAL) until AUTO is
selected.
9.1.4
Select your desired
dispense program (see Section 9.3). Note that there are 2 separate display
windows on the control panel: COATER
AND OVEN. In order to select the
dispense program, the COATER display must be selected. When the COATER display is selected, an
asterisk appears at the left of the COATER display and when the OVEN display is
selected, a plus sign appears at the left of the OVEN display. You can toggle between the two using the
STATION SELECT button on the control panel keyboard. With the COATER display active, press the PROGRAM SELECT button
on the control panel keyboard to toggle through the available programs
(1-9). Alternatively, you can press the
desired program number key followed by the PROGRAM SELECT button to select the
program directly.
9.1.5
Verify the appropriate
oven program is selected. As with the
dispense program, the OVEN display must be active in order to select different
programs (see above instructions).
9.1.6
If necessary, press
INDEX RESET button once to bring the send indexers up (starting position) or
twice for the receive indexer to come up.
(Note that if you press the INDEX RESET button, you must lift the
cassettes completely off the elevator and then replace them in order to
proceed, i.e. for the cassette to go down.) These actions reset the send &
receive elevator and can help user to alleviate/resolve cassette indexer
problems.
9.1.7
Load an empty cassette
onto the receive indexer (right side for the coater track). Load the cassette
containing your wafers and 3 dummy wafers on the send indexer (left side). Make
sure that the cassettes are properly seated on the indexers.
Note: The coater
track processes wafers from left to right (first track, closest to operator and
second track, further away from operator), while facing the machine.
9.1.8
Press the START
button on keypad. The receive cassette
will lower and the send cassette will lower until it senses a wafer. The wafer will then be transported to the
spindle station for the dispense procedure, then to the bake station for soft
baking, and finally to the chill plate and receive cassette.
Note: If the
receive cassette does not lower, remove the cassette and then replace it. Hit
START and the cassette should lower.
SPR 220 – 7.0 photoresist bake skips the cooling step to avoid thermal
shock which induces photoresist cracking.
9.2
Other Functions
on the Control Panel
Beside
the switch functions described above, i.e. Power, Start, Index Reset, Station
Select and Program Select; there are other useful functions, which are
described below:
9.2.1
INDEX RESET: Depressing the Index Reset once,
will return the Send indexer to top position. Receive indexer will not reset
until any wafer in process enters the receive cassette. Depressing the Index
Reset twice, will return the Receive cassette to top position immediately
unless there is a wafer between the processing station and the receive
cassette. The Send cassette is unaffected.
9.2.2
(COATER, OVEN) STOP: Ends processing
immediately. Pressing START will resume processing with the next operation
programmed.
9.2.3
TRANSFER STOP: Immediately stops all indexer and
carriage O-rings. Wafers in transit between stations will remain in place until
START will complete processing and will come to the top position waiting for
the START command.
9.2.4
EVENT SELECT: Used to verify the sequence of
operations and associate parameters for the selected program. The events will
be shown in sequence, but depressing the number followed by the event select
key can also access a particular event.
9.2.5
WAFER LOST: Allows the operator to resume wafer
processing if a wafer is removed or broken during processing or if a sensor
fails to see a transfer. The key is only functional when a wafer has not
been received at its next station after a 6 sec delay.
9.2.6
CLEAR: Used to resume processing when machine is
in programming, diagnostic or calibration mode. Used to turn off Wafer Lost
alarm.
9.2.7
DIAGNOSTIC SELECT: Used to access machine and
sensor state diagnostics. Machine State messages for the send indexer and
processing station will be displayed in the upper display window. Machine State
messages for the receive indexer are displayed in the lower display window.
Sensor State messages are displayed in the top display window only. See Section
4 for a listing of machine and sensor state codes.
9.3
SVGCOAT1 and SVGCOAT2 Programs
There are several coat and bake programs available on these
tracks. The standard positive resist processes use OiR 10i I-line and OCG 825
G-line Positive Photoresists. Appendix 2 provides exact content of each recipe
(program) at the end of this chapter.
9.3.1
SVGCOAT1 Programs
Table 1 - Coater
1 Programs
|
Program (#) |
Resist Type |
Spin Speed (RPM) |
Refractive
Index |
Thickness (um) |
|
*1 |
OiR 10i
(I-Line) |
4100 |
Default value
~1.631 |
~1.1 |
|
*2 |
OCG 825
(G-Line) |
5000 |
Default value
~1.631 |
~1.3 |
|
3 |
OiR 10i
(I-Line) |
2000 |
Default value
~1.631 |
~1.6 |
|
4 |
OCG 825
(G-Line) |
2200 |
Default value
~1.631 |
~2.0 |
|
5 |
OiR 10i
(I-Line) |
1300 |
Default value
~1.631 |
~2.0 |
|
6 |
OiR 10i
(I-Line) |
820 |
Default value
~1.631 |
~2.8 |
|
7 |
None |
|
|
|
|
**8 |
SPR 220 - 7.0 (Broadband) |
1800 |
Default value
~1.631 |
~10.0 |
|
9 |
Edge Bead
Removal (EBR) |
600 |
Default value
~1.631 |
N/A |
*
Standard Programs
** Standard Thick Resist Program: Must
run EBR program #9 before softbake on coater 1.
If
decided not to use EBR program, then softbake must be done on hotplates in Y1.
Table 2 – Oven 1
Programs
|
Program (#) |
Bake Temp. (ºC) |
Bake Time (sec.) |
Chill Time (sec.) |
|
*1 |
90 |
60 |
6 |
|
2 |
90 |
90 |
6 |
|
3 |
90 |
120 |
6 |
|
7 |
90 |
180 |
6 |
|
**8 |
115 |
300 |
0 |
|
9 |
No Bake |
0 |
0 |
* Standard Programs
** Standard Thick Resist Program
Note: Users must adjust program #8 bake temperature
to 115ºC manually and then return to 90ºC after finish baking wafers.
9.3.2
SVGCOAT2 Programs
Table 3 - Coater
2 Programs
|
Program (#) |
Resist Type |
Spin Speed (RPM) |
Refractive
Index |
Thickness (µm) |
|
*1 |
OiR 10i
(I-Line) |
4100 |
Default value
~1.631 |
~ 1.1 |
|
*2 |
OCG 825
(G-Line) |
5000 |
Default value
~1.631 |
~ 1.3 |
|
3 |
OiR 10i
(I-Line) |
2000 |
Default value
~1.631 |
~ 1.6 |
|
4 |
OCG 825
(G-Line) |
2200 |
Default value
~1.631 |
~2.0 |
|
5 |
OiR 10i
(I-Line) |
1300 |
Default value
~1.631 |
~2.0 |
|
6 |
OCG 825
(G-Line) |
6000 |
Default value
~1.631 |
~1.1 |
|
7 |
None |
|
|
|
|
**8 |
SPR 220 - 7.0
(Broadband) |
1800 |
Default value
~1.631 |
~10.0 |
|
9 |
Edge Bead
Removal (EBR) |
600 |
|
N/A |
* Standard Programs
**
Thick Resist Program: Must run EBR program #9 before softbake on
coater 2.
If
decided not to use EBR program, then softbake must be done on hotplates in Y1.
Table 4 – Oven 2
Programs
|
Program (#) |
Bake Temp. (ºC) |
PEB Time (sec.) |
Chill Time (sec.) |
|
*1 |
90 |
60 |