Chapter 4.32

General Resist Parameters

Product

Shipley S1818

Positive Photoresist

OCG 825 35CS

Positive Photoresist

G-Line

OCG Oi R-897 10i

Positive Photoresist

I-Line

Thickness Range (µ):

1.5 – 2.2

1 – 2.2

0.8 – 2.2

Spin Speed (RPM):

Time:

Tool:

Dispense:

5500

30 sec.

(spinner1)

Static or Dynamic

5000

30 sec.

(svgcoat1 & 2)

Dynamic - 500RPM

4100

30 sec.

(svgcoat1 & 2)

Dynamic - 500RPM

Thickness (µm)

1.65

1.3

1.1

Prebake:

Temp:

Time:

Vacuum Hotplate

110 ± 5ºC

45 ± 5 sec.

Or

Convection oven

95 ± 5ºC

30 min.

Vacuum Hotplate

90ºC

90 sec.

Or

VWR Oven

95 ± 5ºC

25 min. ± 5 min.

VWR Oven

90ºC

1 min.

(same)

Exposure- Required Energy (mJ/cm²):

Time:

~150

~ 2 sec.

~ 218

~ 2.9 sec.

~ 213

~ 2.9 sec.

Post Exposure Bake (PEB)

Method:

Bake Temp:

Bake Time:

Chill Time:

N/A

svgdev

Developer Program 8

+

Bake Program 1 (PEB)

120ºC

60 sec.

6 sec.

svgdev

Developer Program 8

+

Bake Program 1 (PEB)

120ºC

60 sec.

6 sec.

Developer:

Method:

Temp:

Time:

Shipley Microposit

MF-319

Immersion

~21.2ºC

1 min.

OCG 934 2:1

premixed

svgdev/puddle

~21.2ºC

1 min.

OPD-4262

premixed

svgdev/puddle

~21.2ºC

1 min.

Hard Bake:

Method:

Temp:

Time:

or

UV Bake:

Method:

Temp:

Time:

VWR Oven

115 ± 5ºC

30 min.

Refer to UV bake

System recipes

VWR Oven

120ºC

30 min.

Refer to UV bake

System recipes

VWR Oven

120ºC

30 min.

Refer to UV bake

System recipes

Stripper:

Method:

Temp:

Time:

PRS-3000

Sink5

80ºC

5 min.

PRS-3000

Sink5

80ºC

5 min

PRS-3000

Sink5

80ºC

5 min.

Rinse:

Method:

Time:

DI H₂O

QDR

2 cycles

DI H₂O

QDR

2 cycles

DI H₂O

QDR

2 cycles

DRY:

Method:

Time:

Spindryer3

Recipe 1

1 min.

Spindryer3

Recipe 1

1 min.

Spindryer3

Recipe 1

1 min.

Table 1

Product

Rohm Haas

SPR-220-7.0

Shipley

UV210-0.6 DUV

Positive Photoresist

Shipley

UV26-2.0 DUV

Positive Photoresist

Thickness Range (µ):

7 - 12

0.4 – 1

1 – 2.0

Spin Speed (RPM):

Time:

Tool:

Dispense

1800

30 sec.

SVGG-1, svgcoat1 & 2

Static

6000

30 sec.

(svgcoat6)

Dynamic – 500 RPM

2500

30 sec.

(svgcoat6)

Dynamic – 500 RPM

Thickness (µm)

10

.42

2.2

Prebake:

Temp:

Time:

115 ± 1ºC

300 sec.

Proximity

130 ± 1ºC

1 min.

Proximity

130 ± 1ºC

1 min.

Exposure- Required Energy (mJ/cm²):

Time:

~300 mJ/cm²

at 20 mW/cm² should expose ~15 seconds

15 to 30

–-

15 to 30

–

Post Exposure Bake (PEB)

Method:

Bake Temp:

Bake Time:

Chill Time:

Wait at least 30 minutes after exposure before performing PEB

115 ºC – 6.5 minutes hotplate

Vacuum hotplate

130ºC

1 min..

6 sec.

Vacuum hotplate

110ºC

60 sec.

6 sec.

Developer:

Method:

Temp:

Time:

Rohm Haas LDD-26W

Tank develop – 3-15 minutes slight agitation

Shipley

LDD-26W

Svgdev6

spray/puddle

~21.5ºC

1 min.

Shipley

LDD-26W

svgdev6

spray/puddle

~21.5ºC

1 min.

Hard Bake:

Method:

Temp:

Time:

or

UV Bake:

Method:

Temp:

Time:

Hot plate

80 ºC

15 min

UVbake not compatible with thick resists

VWR Oven

120ºC

30 min.

Refer to UV bake

System recipes

VWR Oven

120ºC

30 min.

Refer to UV bake

System recipes

Stripper:

Method:

Temp:

Time:

PRS-3000

Sink5

80ºC

30 min.

or

Matrix

Plasma

2 min. 30 sec.

PRS-3000

Sink5

80ºC

5 min.

or

Matrix

Plasma

1 min. 30 sec.

PRS-3000

Sink5

80ºC

5 min.

or

Matrix

Plasma

2 min. 30 sec.

Rinse:

Method:

Time:

Manual DI H₂O rinse

DI H₂O

QDR

2 cycles

DI H₂O

QDR

2 cycles

DRY:

Method:

Time:

manual dry - gently with N2 gun

Spindryer3

Recipe 1

1 min.

Spindryer3

Recipe 1

1 min.

Table 2

Other Strippers and Thinners

Stripper

Thinner

Shipley SVC-14 Positive Resist Stripper

(Recommended for DUV photoresist

Shipley Microposit Remover 1165

(General positive photoresist stripper)

Microposit Thinner Type A

Revision History