Rev.
No.
|
Date
|
Authors
|
Description
of Revision
|
4.00
– General
Resist Parameters
|
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|
01 02 03 04 |
9/02 8/05 5/06 4/07 4/08 |
K. Chan,
M. Kushner S.
Parsa K. Chan S. Parsa M.
Kushner |
- New manual writeup. - Added
STR-1075 resist information omitted and SPR-220 resist parameters. - Changed developer type for SPR-220 thick photoresist and a couple of minor things. - Added method
of dispense for the recipes and minor clean up the manual. - Minor editing corrections for Post Exposure
Bake column for consistency |
|
4.10 – Exposure Tools |
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|
00 01 02 03 04 |
9/01 3/06 5/07 12/07 4/08 |
S.
Parsa K.
Chan S.
Parsa S. Parsa S. Parsa |
N/A - Added
pellicle puncture warning note for single smif pod. - Update
for the new laser (Cymer 5600) and the ASML operation. - Major
update included Mix&Match and the latest
operational procedure. - Added Incoming reticle
qualification procedure "go/no go" decision criteria. |
|
4.12 – GCA 8500 Wafer
Stepper (6”) (gcaws6) |
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|
00 01 02 03 04 |
9/04 9/05 10/05 2/07 6/07 |
K.
Chan, M. Kushner K.
Chan K. Chan K. Chan D. Queen |
N/A N/A N/A N/A 1) Updated syntax errors in Section 8. 2) Reference to the computer system now
reflects that the 3) Reboot procedure in Section 9.5 updated for
the new operating system. |
|
4.13 – GCA 6200 Wafer Stepper (4”) (gcaws2) |
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|
00 01 02 |
6/05 6/07 7/08 |
M.
Kushner D.
Queen E.
Szentkiralyi |
N/A 1) Adopted the chapter layout of gcaws6.2) Updated the syntax for the new computers command set.3) Updated the computer restart procedures4) Focus/exposure diagrams now show relative references for focus/exposure tests.5) Added Appendix C for manual wafer loading.
- Grammatical corrections and clarification of operating
instructions throughout the chapter. |
|
4.14 – Karl Suss MA6 Mask Aligner (ksaligner) |
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|
00 01 02 03 04 05 06 |
2/00 5/01 5/03 6/04 8/05 3/06 11/07 |
L. Chrostowski M. Wasilik M. Wasilik M. Wasilik M. Wasilik M. Wasilik M. Wasilik |
N/A N/A N/A N/A - Addition of Figure 4. - Changes in Section 10.3, Overcurrent Error
During Exposure. 1) Added table under Section 8.0 Available Process, Process Notes. 2) In Subsection 9.6 Water Exposure, added a NOTE and a graph. 3) In 9.7.9, added sentence on coordinates. |
|
4.15 – Canon 4X Projection Mask Aligner
(canon) |
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|
00 01 |
5/04 6/07 |
K. Chan K. Chan |
N/A - Added X mm and Y mm
setting values, blew off dust particles tightening wafer disk thumbscrews
lines and changed mask holder to mask chuck. |
|
4.16 – Quintel Mask Aligner (quintel) |
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|
00 01 02 03 04 |
7/02 8/03 5/06 7/08 7/08 |
K. Scott, K. Chan K. Scott, K. Chan K. Chan E. Szentkiralyi P. Guillory |
N/A N/A - Changed substrate thickness requirement and
wafer chuck vacuum release procedure. - Grammatical corrections and clarification of
operating instructions throughout the chapter. - Modified Subsections 9.9.1 and 9.9.2 |
|
4.17 – JEOL 6400 SEM and Nanometer Pattern Generation System (jeol107) |
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|
00 01 02 03 |
12/00 12/03 7/07 6/08 |
C.H. Williams III F.W. Strong Z.
Jacobson M. Leullier |
N/A N/A - Addition of
figures - Renumbered the
chapter 4.42 (was 4.16) |
|
4.18 – Crestec CABL-9510CC High Resolution
Electron Beam Lithography System (crestec) |
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|
00 |
5/08 |
K. Chan, C. Chase, M. Kuntz |
Initial
write-up. |
|
4.20 – Resist Treatment |
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|
4.21
– SVG 8626 Photoresist
Coat Track (6”) (svgcoat1) |
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|
00 01 02 03 04 05 |
12/01 4/03 5/03 2/06 12/07 8/08 |
S. Parsa K. Chan, M. Kushner K. Chan K. Chan K. Chan K. Chan |
N/A N/A N/A 1) Microlab
does not offer STR-1075 photoresist any longer. 2) Deleted
STR-1075 photoresist programs and added SPR 220 -
7.0 photoresist program on svgcoat1. 3) Added
SPR-220 photoresist bake programs and made other
minor changes. - Changed photoresist company names.- Divided svgcoat1 and 2 manuals into two separate chapters andchanged necessary information. |
|
4.22 – SVG 8626 Photoresist Coat Track (4”) (svgcoat2) |
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|
00 01 02 03 04 05 |
12/01 4/03 5/03 2/06 12/07 8/08 |
S. Parsa K. Chan, M. Kushner K. Chan K. Chan K. Chan K. .Chan |
N/A N/A N/A 1) Microlab
does not offer STR-1075 photoresist any longer. 2) Deleted
STR-1075 photoresist programs and added SPR 220 -
7.0 photoresist program on svgcoat1. 3) Added
SPR-220 photoresist bake programs and made other
minor changes. - Changed photoresist company names.- Divided svgcoat1 and 2 manuals into two separate chapters and changed necessary information. |
|
4.23 – SVGG-1 Photoresist Coat
Track (4”) (svgcoat3) |
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|
00 01 02 03 |
9/02 8/07 9/07 8/08 |
M.
Wasilik, S. Parsa S.
Parsa K. Chan K. Chan |
N/A - Added
new I-line resist programs, rearranged programs, and other updates. - Updated
I-line resist information and programs. - Updated
resist information and programs after converting svgcoat3 to
4” wafer process. |
|
4.24 – SVG 8800 Coat Track (6”)
(svgcoat6) |
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|
00 01 02 03 04 05 06 07 |
5/01 12/01 2/04 9/04 5/07 12/07 9/08 9/08 |
S.
Parsa K. Chan K. Chan K. Chan K. Phoa K. Chan K. Chan S. Parsa |
N/A N/A N/A N/A - Change
in Note of Subsection 9.1.3 and addition of Section 8.6 (hard bake). - Made missing word corrections, updated photoresist and program information.
- Updated and added G-line developer
program and information. - Rewritten as a standalone chapter including latest information. |
|
4.25 – SVGDEV Photoresist Develop Track (4”) (svgdev) |
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|
00 01 02 |
10/03 2/06 5/07 |
M. Kushner K. Chan K. Phoa |
N/A - Eliminated STR-1075 thick resist develop process and made program
corrections. - Changed Program #7 to 9 as no bake. |
|
4.26 – SVG 8800 Develop Track (6”) (svgdev6) |
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|
00 01 02 03 04 05 |
5/01 12/01 2/04 9/04 5/07 12/07 |
S.
Parsa K. Chan K. Chan K. Chan K. Phoa K. Chan |
N/A N/A N/A N/A - Change
in Note of Subsection 9.1.3 and addition of Section 8.6 (hard bake). - Made missing word corrections, updated photoresist and program information. |
|
4.27 – UVBAKE – Fusion M150PC
Photostabilizer System (uvbake) |
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|
00 01 02 |
4/01 11/06 3/07 |
M.
Wasilik A.
Pongracz M.-C.
Tien |
N/A - Updated the recipes list and made small
revisions to the content of the manual. - Updated
Troubleshooting Guidelines. |
|
4.28 – Matrix 106 Resist Removal System (asher) |
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|
00 01 02 |
1/00 11/05 8/08 |
S.
Parsa S.
Parsa L.
Petho |
N/A - Added
Figures 1 and 2, recipe details in the Appendix and minor changes. - Small
modifications and typos correction. |
|
4.29 – HMDS (Primeoven & Sink4 HMDS) |
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|
00 01 |
5/05 2/06 |
M.
Kushner, S. Parsa K.
Chan |
N/A 1) Changed
initial vacuum time on step 7. 2) Added
programming commands and clarify programming procedures. 3) Added
process, gas and general primeoven information on
this revision also. |