Chapter 4 – Photolithography

4.00       General  Resist  Parameters

4.10       Exposure  Tools

4.11      ASML DUV Stepper Model 5500/90 (6”) (asml)

4.12      GCA 8500 Wafer Stepper (6”) (gcaws6)

4.13      GCA 6200 Wafer Stepper (4”) (gcaws2)

4.14      Karl Suss MA6 Mask Aligner (ksaligner)

4.15      Canon 4X Projection Mask Aligner  (canon)

4.16      Quintel Q4000 Mask Aligner (quintel)

4.17      JEOL 6400 SEM & Nanometer Pattern Generation System (jeol107)

4.18      Crestec CABL-9510CC High Resolution Electron Beam Lithography System (crestec)

4.20       Resist  Treatment

4.21      SVG 8626  Photoresist Coat Track (6”) (svgcoat1)

4.22      SVG 8626  Photoresist Coat Track  (4”) (svgcoat2)

4.23      SVGG-1  Photoresist Coat Track  (4”) (svgcoat3)

4.24      SVG 8800 Coat Track (6”) (svgcoat6)

4.25      SVGDEV Photoresist Development Tracks (4”) (svgdev)

4.26      SVG 8800 Develop Track (6”) (svgdev6)

4.27      UVBAKE – Fusion M150PC Photostabilizer System (uvbake)

4.28      Matrix 106 Resist Removal System  (asher)

4.29      HMDS (Primeoven & Sink4 HMDS)

4.30      Headway Photoresist Spinner (spinner1)

4.40       Others

4.41   Mix & Match Process (Baseline Group Report of 12/26/06)

4.42   Photomask Cleaning (sink12 photomask cleaning station)