(Tylan5)
1.0
Title
TYLAN5 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric
Furnace (4” Only)
2.0
Purpose
TYLAN5 is an atmospheric furnaces that is designed for Gate
oxidation, Dry oxidation and Nitrogen Annealing. The furnace accommodates
wafers up to 4” in diameter.
3.0
Scope
This chapter covers the general furnace description of TYLAN5,
TYCOM Terminal and operation procedures which include process recipe loading,
wafer loading/unloading, user level problem diagnosis, and wafer cleaning
requirements.
4.0
Applicable Documents
4.1
TYTAN Diffusion Furnace System Instruction Manual (copy in
Office).
4.2
TYCOM 9900 Microprocessor Control System Instruction Manual (copy
in Office)
4.3
Oxide Growth Chart, Semiconductor Technology Handbook (in the
binder stored under TYCOM terminal)
4.4
Material Safety Data Sheets for TCA (1,1,1-Trichloroethene),
Oxygen, Nitrogen, and Forming Gas H2/N2 (copy in Lobby).
5.0
Definitions & Process Terminology
5.1
MOS Furnace: This kind of
furnaces is used to fabricate MOS devices (IC), whose performance can be greatly
impacted by trace contaminants. Wafers processed in a MOS furnace should
absolutely be MOS compatible (IC device). Absolutely no metal film in any MOS
Furnace, except the MOS sintering furnace, which allows only Al film.
5.2
Non-MOS Furnace: The wafers processed in this kind of furnaces may contain
materials that are not compatible with the MOS processes. If CMOS devices are
processed in a Non-MOS furnace, the electric performance of the devices may be
changed. Wafers with metal films can be processed in Non-MOS furnaces only with
Microlab managerial permission.
5.3
Dry/Wet Oxidation: A high temperature process that oxidizes the underlying silicon
to form silicon oxide. Dry oxidation uses oxygen for better process control.
Wet oxidation uses both DI water and oxygen for fast reaction rate.
5.4
Gate Oxidation: A special dry oxidation process that produces high quality oxide
with precise thickness control.
5.5
Annealing: A high temperature process that uses nitrogen to keep wafers in
an inert atmosphere. Major applications include dopant diffusion and
activation, LTO/PSG densification, film stress release, and etc.
5.6
TCA Cleaning: A high temperature process that uses TCA and oxygen to clean the
furnace quartz parts and interior, by removing possible metallic contaminants in
these areas.
6.0
Safety
Follow general safety guidelines in the lab as well as the
specific safety rules as per follow:
6.1
Electric Shock Hazard: TYSTAR furnaces utilize high electric
power (high amperages) to generate heat.
Do not open the side panels or touch the high power electrical parts in
the furnace cabinet.
6.2
Chemical Hazard: TCA (1,1,1-Trichloroethene) is used for
in-situ cleaning of quartz wares. It poses moderate health and high fire
hazard. Please refer to the MSDS for first aid information.
6.3
Burn Hazard. Cantilevers, boats, and wafers coming out of the furnace are
very hot. Wear face shield when
loading/unloading wafers. Proceed with caution. Avoid touching of any furnace
quartz ware to prevent burning of your hands and contamination of the furnace.
No flammable chemical, especially organic solvents, in the load station when
the tube is open.
6.4 All new recipes
must be checked by the process staff, before they can be used on any TYLAN
furnaces. Customized recipes should be stored on the user’s diskette, not the
standard diskettes.
7.0
Statistical/Process Data
7.1
Problem and comment section under equipment section of the wand.
7.2
Enable message for individual TYSTAR furnace.
8.0
Available Process, Gases, Process Notes
Available Processes
8.1
Gate Oxidation.
8.2
Dry Oxidation (maximum temperature 1050ºC).
8.3
Nitrogen annealing (maximum temperature 1050ºC).
8.4
TCA clean.
Available Gases
8.5
Nitrogen (N2): Used to purge out room air and keep the
process tube in an inert atmosphere.
8.6
Oxygen (O2): Used for dry/wet oxidation.
8.7
TCA (C2H3Cl3): Used for in-situ
process tube cleaning.
8.8
Nitrogen Carrier (N2cARR): Used to carry TCA vapor to the process
tube.
Process Notes
8.9
Wafer cleaning requirements before loading into TYLAN furnaces
(See also Chapter 5.0)
8.9.1
Photo-resist on the wafer surface must be stripped first in
PRS3000 bath of Sink5, Technics-C, or Matrix. Then cleaned in Sink8 (4”)
piranha bath. New wafers can skip this step.
8.9.2
All wafers then cleaned in Sink6 piranha bath. Wafers just
unloaded from an MOS furnace can be loaded into another furnace without further
cleaning.
8.10 Additional wafer
requirement for the MOS furnaces: Only new wafers and wafers processed only in
MOS clean furnaces can be loaded into a MOS furnace after cleaning. Wafers that
have been processed in a Non-MOS furnace or have gone through any Non-MOS
processes can not be loaded into any MOS furnace. ABSOLUTELY NO EXCEPTION.
8.11
No wafer processed with any metal films, even the film is stripped
or covered, is not allowed in TYLAN5.
9.0
Overall Furnace Operation
9.1
General TYLAN Furnace Information
The TYLAN Furnace consists of three basic modules: Load Station
Module, Furnace Module, and Source Cabinet Module. Microlab members have access
to the Load Station Module in the clean room area. The other two modules are in
the Tylan service chase. Only Microlab staff with proper training has access to
these two modules due to potential hazards.
The Load Station Module houses a laminar flow unit with HEPA
filter for clean air distribution. A Boat Loader Unit opens/closes the furnace
door and pulls-out/pushes-in the cantilevers with wafer boats sitting on top.
The operation can be automatically controlled by a process recipe, or manually
using the ROP (see Section 9.3).
The Furnace Module consists of a quartz process tube, thermal
couples, and heating elements. It is divided into three zones: Load, Center,
and Source. The temperature is controlled through a PID electronic board (DTC).
All the control parameters can be set in the process recipe. The volume of the
quartz tube is approximately 25 liters. The process gas flows into the tube
from the Source end and vented through a hole on the Load end.
The Source Cabinet Module contains several Mass Flow Controllers
(MFC), which regulate the process gas flows, and the TCA bubbler.
9.2
TYCOM Terminal
The TYCOM Terminal controls/monitors all the TYLAN/TYSTAR Furnace
operations. It consists of a CPU with two floppy disk drives, a CRT monitor and
a keyboard. Disk drive #2, on the right side, is used for viewing and loading
of recipes. The auxiliary drive is used for copying diskettes. The floppy disk
used has a special format. All the standard TYLAN5 recipes are store on the
diskette labeled “STANDARD DISK”. Please ask staff if you need one to store
your customized recipes.
9.2.1
TYCOM commands – TYCOM CPU only recognizes CAPITAL letters only.
You can use the numerical key pad on the right hand side of the keyboard to
enter numbers. However, do not use the [Enter] key on the numerical key pad. It
will cause error when loading a recipe.
|
Commands |
Function |
Example |
|
DI DI |
Displays the recipe directory of the
diskette in Drive #2 |
|
|
DI RE “recipe name” |
Displays the content of a recipe on the diskette in Drive #2 |
DI RE DRYOXA |
|
LO “recipe name” “#” |
Load a recipe to a TYSTAR furnace |
LO DRYOXA |
|
DI ST “#” |
Displays current status of a TYSTAR furnace (see Section 9.2.2) |
DI ST 5 |
|
DI DE “#” |
Displays the system configuration of a TYSTAR furnace |
DI DE 5 |
|
DI AL “#” |
Displays previous process alarms of a TYSTAR furnace |
DI AL 5 |
9.2.2
Display Furnace Status - When you use DI ST commands, the CRT monitor
displays the status of the TYSTAR furnace. This information is very important,
especially for equipment problem diagnosis. The following example is used to
explain the information users should know. The furnace status to be displayed
is TYLAN5 with recipe HIN2ANNL loaded but not running (Idle state).
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02/023/07 |
16:30:32 |
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*=DISABLED |
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TUBE |
STATUS |
PROCID |
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ET |
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STEP |
TIME-TO-GO |
STEP ET |
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005 |
READY |
HIN2ANNL |
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00:00:00 |
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0000 |
00:00:00 |
00:00:00 |
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OUTPUTS |
RELAYOUT |
RELAYIN |
INPUTS |
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N2 = |
0.9 |
N2 = |
ON |
CCIN1 = |
OFF |
TEMPL = |
H |
750.2 |
2118 |
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ANA02 = |
0 |
CCOUT2 = |
OFF |
O2PRS = |
OFF |
TEMPC = |
G |
750.5 |
0632 |
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O2 = |
.0 |
O2 = |
OFF |
CCIN3 = |
OFF |
TEMPS = |
G |
749.5 |
0895 |
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N2CARR = |
.0 |
N2CARR = |
OFF |
CCIN4 = |
OFF |
CALIBL = |
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752.1 |
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ANA05 = |
.0 |
VENT = |
OFF |
CCIN5 = |
OFF |
CALIBC = |
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750.9 |
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ANA06 = |
.0 |
CCOUT6 = |
OFF |
BPIN = |
ON |
CALIBS = |
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747.3 |
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ANA07 = |
.0 |
CCOUT7 = |
OFF |
BPOUT = |
OFF |
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ANA08 = |
.0 |
TCA = |
OFF |
CCIN8 = |
OFF |
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TEMPL = |
750.0 |
CCOUT9 = |
OFF |
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N2 = |
G |
0.9 |
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TEMPC = |
750.0 |
CCOUT10 = |
OFF |
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ANA02 = |
G |
.0 |
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TEMPS = |
750.0 |
CCOUT11 = |
OFF |
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O2 = |
G |
.0 |
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CCOUT12 = |
OFF |
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N2CARR = |
G |
.0 |
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CCOUT13 = |
OFF |
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DTCENA = |
ON |
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LOAD = |
OFF |
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UNLOAD = |
OFF |
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