Chapter 6.14

Edwards EB3 Electron Beam Evaporator

(edwardseb3)

 

1.0         Title

edwardseb3 ¡V electron beam (e-beam) evaporation process

2.0         Purpose

This document has specific information about the Edwards EB3 e-beam evaporator in 432A to help operators understand its safe and correct operation.

3.0         Scope

The Edwards e-beam evaporator is a high vacuum e-beam evaporation system. One mechanical pump is installed for rough pumping and one turbo pump for fine pumping. A liquid Nitrogen trap is fitted to the Auto 306 vacuum coaters. The LN2 trap can be filled with 1.4 litres of LN2; this is sufficient for up to approximately eight hours of operation. The purpose of the LN trap is to increase the pumping speed for water vapor, a significant residual gas in a vacuum systme. The e-gun can accommodate four crucibles at a time to allow multiple and sequential evaporations. There are three 6-inch wafer holders. If you are going to evaporate other sizes of wafers or small pieces, you could use the Kapton tape to tape your samples on a 6-inch wafer. A crystal monitor enables direct read-out in Å/sec resolution for deposition rate and in nm for thickness. The edwardseb3 may be used to evaporate metals and dielectrics.

4.0         Applicable Documents

Revision History

Description of a basic vacuum system:

http://microlab.berkeley.edu/labmanual/chap6/vacuum.pdf

Vendor manual: AUTO 306 Vacuum Chamber & EB3 Multihearth Electron Beam Source.

5.0         Definitions & Process Terminology

5.1     AUTO 306 vacuum chamber: contains e-gun, hearth liner, wafer holder, crystal monitor and heat lamp. The door has a magnetic bearing and users should gently close the door without adding forces on it to assure good seal of the chamber.

5.2         Vacuum control panel: allow you to vent and pump the chamber.

5.3         EB3 power supply unit: sitting on the floor at bottom left of the vacuum chamber. Always ON.

5.4         EB3 source control: switch on/off of high voltage control of e-gun as well as analog control of e-gun current.

5.5         Yogogawa function generator for ebeam sweep control: provides sinusoidal, square wave and other waveforms to the Edwards beam sweep circuits for sweeping the ebeam in the X and/or Y directions.

5.6         EB3 turret control: control the rotation of the crucibles.

5.7         Hearth/crucible: 4 crucibles are the maximum capacity. You may use intermetallic or graphite crucibles depending on the metals you are going to evaporate.

5.8         Crystal monitor: monitors the evaporation rate by correlating deposited metal thickness to the amount of deviation from its original crystal resonant frequency.

Note:    It is the labmember¡¦s responsibility to replace the crystals in the thickness monitor. Crystals are available in the 406 office during staff hours.

5.9         Evaporation materials: Al, Ti, Au, Ni, Ge, Cr, Cu, Pd, and Pt. For other metals and dielectrics, e-mail edwardseb3@silicon to propose your material for evaporation.

6.0     Safety

6.1     Read all relevant instructions before you operate any accessories.

6.2     Surfaces within the AUTO 306 may be very hot or very cold. Do not touch hot or cold surfaces such as the pump body, source holders, vacuum chamber and components of the e-beam source.

6.3     Intense light will be emitted from the evaporation materials. Always use dark safety glasses when you look in the chamber.

6.4     Observe all safety precautions when you come into contact with dangerous substances, which have been used with the evaporation materials.

6.5     Wear clean lint-free gloves when you handle components in the chamber to prevent contamination of the evaporation materials and its accessories.

6.6     Do not operate the e-beam source when there is magnetic interference.

6.7     Do not overfill the hearth/crucible with evaporation materials. If you do, molten materials can spill out of the crucible and contaminate the e-beam source and evaporation materials in other hearths.

6.8     Ensure the correct crucible is fitted to the hearth.

6.9     Ensure the sources inside the crucible are not higher than the crucible edge. It will hinder the rotary drive for switching between crucibles.

6.10   Do not add extra forces when you close the chamber door. It will damage the magnetic bearing.

7.0     Statistical/Process Data

Au: 5.5 Å/sec evaporation rate at 130 mA gun current.

Ti: 2.5 Å/sec evaporation rate at 120 mA gun current.

8.0         Available Processes, Gases, Process Notes

8.1     Pumping speed: 4.5 hours to reach 9e-7 torr.

8.2     Pumping speed with heat lamp (70ºC chamber temperature): 2.5 hours to reach 9e-7 torr.

8.3     Available metal data in FTM7 crystal monitor control:


 Layer#

Metal Name

Acoustic Impedance

(105 g/cm2-sec)

Density (g/cm3)

Tooling Factor

1

Ti

14.05

4.50

0.30

2

Au

23.17

19.30

0.30

3

Ni

26.66

8.91

0.30

4

Ge

17.10

5.35

0.30

5

Cu

20.20

8.93

0.30

6

Pd

24.72

12.00

0.30

7

Pt

36.06

21.40

0.30

8

Cr

28.94

7.20

0.30

8.4     Inspect the door seal before closing the chamber. If you see particulates or any contamination, wipe gently with a fresh clean wipe and a small amount of isopropyl alcohol. The door seal is a contiguous viton o-ring and requires no vacuum grease for sealing. Many vacuum greases have relatively high vapor pressure and adding any to the door seal will make it more difficult for the system to achieve best base pressure.

9.0         Equipment Operation

9.1         Enable edwardseb3 on WAND.

9.2         Check the vacuum. The display on the vacuum control panel (Figure 1) should read FINE PUMPING. If not, refer to Section 10  (Troubleshooting) of this manual. If problem persists report the FAULT and do not operate the machine.

9.3         Make sure the high voltage control switch is OFF.

9.4         Make sure the gun control switch is OFF.

9.5         Press Seal on the vacuum control panel. This will close the valve to turbo pump to prevent contamination from venting.

9.6         Press Vent on the vacuum control panel. This will vent the chamber.

9.7         Do not try to open the door until the display on the vacuum control panel reads 7.6+2 torr (room atmosphere).

9.8         Open the door gently by pulling the door lever upward first and then outward.

9.9         Load the crucibles. Make sure your sources inside the crucible did not exceed the crucible height. This will hinder the rotation of the hearth liner.

9.10      Make a note of your crucibles with the corresponding number on the turret control panel (Figure 2). You will use the turret control panel to switch to different crucibles for multiplayer evaporation; therefore, it is important to know where your crucibles sit in the hearth liner.

9.11      Load the wafer. Make sure the 6¡¨ wafer sits tightly on the holder.

9.12      Press SS1 on the shutter control panel (Figure 3). A green LED will be lit. This will close the shutter and the shutter should sit at the proximity above the crucible.

9.13      Close the door gently.

9.14      Do not use any vacuum grease on the door seal.

9.15      Press Process on the vacuum control panel. It will activate the mechanical pump to do rough pumping.

9.16      Fill the LN trap before you use the vacuum coater to reduce the pump-down time.

9.17      Select the metal to be deposited on the crystal control monitor panel to match the crucible by pressing Data button (FTM-7, Figure 4) until the light adjacent to layer is lit.

Note:    It is the labmember¡¦s responsibility to replace the crystals in the thickness monitor. Crystals are available in the 406 office during staff hours.

9.18      Use the arrow keys to select layer numbers (refer to Section 8.2 for the corresponding metals).

9.19      Consult Section 8.1 for pumping time vs. chamber pressure. Evaporation is better to be done at pressure at or lower than 1e-6 torr.

9.20      When the pressure goes down to the wanted pressure, turn on the high voltage control by pressing the button (Figure 5).

9.21      After the LED labeled power is lit, turn on the gun control by pressing the button (Figure 5).

9.22      After the LED labeled gun is lit, slowly turn the gun current knob clockwise until the gun current meter reads 30 mA. Stay under this current for two minutes. This will degas the e-gun.

9.23      At the mean time, see through the observation window on the chamber door to see if the e-gun is hitting around the center of the source. If not, report a FAULT so that the technician could make adjustment.

9.24      Slowly increase the current to 60 mA and you will see the source glow.

9.25      Wait for 2 minutes for the source to outgas.

9.26      Open the shutter by pressing SS1 on the shutter control panel. The green LED will be off.

9.27      Slowly increase the gun current and read the evaporation rate on the FTM-7 panel simultaneously. Refer to process data section to general evaporation rate vs. gun current for different metals.

9.28      The Yogogawa function generator is powered ON by pressing the Blue power button on the lower left-hand front side of the unit.  Wait 10 seconds for unit to complete self-checks.  Channel 1 controls X and Channel 2 controls Y sweep.  Channel selection is made by pressing either the ¡§CH1¡¨ or the CH2¡¨ buttons on the upper left-hand side front of the unit.  Once a channel is selected use the touchpad/monitor to select voltage, waveform, frequency, dc offset parameters.  Use the rotary knob on the upper right-hand front to adjust selected parameters.    Typical set up; both channels on, running a sine wave at 12 volts p-p, 5 ¡V 15hz with 0 dc offset.  This provides a uniform sweep, prevents spitting and provides uniform melt of the source material.  Adjust the DC offset if most of the material is more in one quadrant than another.

9.29      After the evaporation, close the shutter and let the machine cools for 15 minutes.

9.30      Press Seal to close valve to turbo pump.

9.31      Press Vent and wait until the pressure reads 7.6+2 torr.

9.32      Open the door gently.

9.33      Unload the sample and crucibles.

9.34      Close the door gently.

9.35      Press Process to pump the machine down to base pressure.

9.36      Disable edwardseb3 on WAND.

10.0      Troubleshooting Guidelines

10.1      Rectification of interlock problem

10.2      Safety interlock

10.3      Vacuum level interlock

10.3.1      Hi-Vac Error recovery

      Hit reset then cycle on Vacuum Controller. If problem persists, enter into Faults.

10.4      Water interlock

10.5      Rotary drive interlock

10.6      Source control overload

10.7      Power supply unit circuit breaker trip

10.8      Motorized turret drive motor overload

10.9      Crystal Monitor Problems

10.9.1      x1 and x2 crystal indicators blinking

      Replace crystal

10.9.2      No response from monitor

      Enter into Faults

10.10        Gun Control Panel

10.10.1   No display

      Check interlocks are made on controller. Enter into Faults.

10.11        Crucibles

The following recommendations  (from Poco Graphite, a specialty material supplier) address several common crucible problems.

10.11.1         Melt Levels

The most common cause of crucible failures is overfilling. Overfilling can cause the melt to spill over the edge of the crucible. When a spillover occurs, a thermal hort is created between the crucible and the hearth. The resultant thermal stress causes the crucible to crack. For this reason a maximum melt level of 80% of the crucible capacity and a minimum melt level of 30% of the crucible capacity are recommended.

10.11.2         Crucible Contact

Another significant cause of crucible failures is cracking due to the improper seating of the crucible in the hearth. Out of round or chiseled hearths often create nonuniform mechanical stresses on the crucible walls. For the longest crucible life and for the most reproducible evaporation results, contact between the graphite crucible and the copper hearth should be restricted to the bottom of the crucible and the bottom on the hearth cavity. A circular graphite or copper shim is frequently used to achieve proper contact.

10.11.3      Handling

Improper crucible handling and storage also can be the source of crucible life problems. Crucibles should be handled with tongs, gloves or finger cots; never with bare hands or fingers. Used crucibles available for reuse should be stored in a dry, oxygen-free environment.

10.11.4      Aluminum Melts

Aluminum carbide formation affects the life of crucibles used for aluminum evaporation. The aluminum carbide forms a transparent, yellowish film on the surface of the aluminum. When the film covers the entire surface of the aluminum, the evaporation rate is reduced to near zero. The presence of this phenomenon is indicative of excessive crucible temperature. The beam power should be reduced to minimize the formation of aluminum carbide.

11.0      Figures & Schematics

11.1      Vacuum Control Panel

Figure 1

11.2      Gun Control Panel

Figure 2

11.3      Turret Control Panel

Figure 3

11.4      Shutter Control Panel

Figure 4

11.5      Crystal Monitor Control Panel

Figure 5

11.6      Temperature Control Panel

Figure 6