Rev. No.
|
Date
|
Authors
|
Description
of Revision
|
6.0
- Sputterers
|
|
6.01 - Hummer Sputtering System (for SEM samples ONLY)
|
|
00
01
|
1/02
12/06
|
K. Chan
K. Chan
|
N/A
- Equipment moved to Room 145.
|
|
6.02 -
Novellus m2i Sputtering System
|
|
00
01
02
03
|
4/03
10/04
6/07
4/08
|
L. Voros, S.
Parsa
H. Takekuchi,
J. Donnelly
J. Lai
J. Donnelly
|
N/A
N/A
- Extensive
updates.
- Added a sentence at the end of Section 8.1.2
and Section 10.4 Fault Recovery.
|
|
6.03 -
Randex System
|
|
00
01
02
03
04
05
|
5/03
6/03
10/05
10/06
7/07
1/08
|
R. Hamilton
S. Parsa, K.
Dunphy
M. Linan
M. Linan
W. Flounders
R. Hamilton
|
N/A
N/A
- Changes
in Target Section 9.1
- Added Section 9.5 –
Cryo Pump Regeneration Procedure.
- Added
paragraphs in Section 10.0 – Troubleshooting Guidelines
- Deleted
Pt target in the inventory list as it has worn out and will not be replaced.
|
|
6.04 -
CPA Sputtering System
|
|
00
01
02
03
04
|
8/00
8/03
10/04
3/06
7/08
|
S. Parsa, J.
Chang
K. Chan
S. Parsa
K. Chan, S.
Parsa
E.
Szentkiralyi
|
N/A
N/A
N/A
- Added
cross-contamination warning message (pallets), and other changes to
reorganize /update the operation of the tool.
- Grammatical corrections and
clarification of operating instructions throughout the chapter.
|
|
6.06 -
MRC 8600 Operation
|
|
99
01
|
7/02
3/04
|
E. Kim
M. Wasilik
|
N/A
N/A
|
|
6.07 -
Edwards Auto
306 DC and RF Sputter Coater
|
|
00
01
02
03
04
05
06
|
7/04
9/05
10/05
6/06
8/06
8/06
10/06
10/06
3/07
7/07
|
C. White
W. Flounders
R. Hamilton
R. Hamilton
S. Parsa
R. Hamilton
J. Morford
W. Flounders, S. Parsa
D. Queen
R. Hamilton
|
- Initial
write-up of chapter.
- Additional info on dielectric materials in
Section 5.8.
- Additional info on metal targets in Sections
9.11.2 and 9.12.2.
- Added one line on previous metal targets in
Section 8.0 and one line on max. temp. of the substrate heater in Section 3.0.
- Added Note in Section 9.4.
- Au (gold) out of Available Targets in Section
8.0.
- Modified Section 9.9 (MFC).
- Cut off limit defined for power. Added
process data in Section 7.0.
- Updated available materials and RF deposition instructions.
- Updated subsection 5.7 Sputtering Materials.
|
|
6.08 -
AMS Aluminum Nitride
|
|
00
01
02
03
04
|
3/05
6/05
3/06
3/07
5/08
|
G. Piazza
M. Wasilik
M. Wasilik
R. Hamilton
W. Flounders
|
Initial
write-up of chapter.
N/A
- Material
restrictions update.
- Updated
vendor’s contact.
- Deleted previous subsection 6.3, modified 8.4 Materials Restrictions.
|
|
6.10 -
Evaporators
|
|
6.11 -
NRC Evaporator
|
|
00
01
03
04
|
9/03
10/06
4/07
8/07
|
A.M. Fennimore
B. D. Sosnowchik
D. Queen
J. Morford
|
N/A
- Major changes in Sections 2.0 Purposes, 6.0
Safety, and 9.0 Equipment Operation.
- Minor grammatical updates.
- Changes in Sections 9.7, 9.10, 9.11 and 9.12.
|
|
6.12 -
Veeco 401
Vacuum System
|
|
00
01
02
03
|
1/02
9/06
3/07
3/08
|
N. Chronis
J. Mehl
D. Queen
J. Morford
|
N/A
N/A
- Added Appendix on the Rotating Sample Stage
and updated the operating procedures.
- Added Section 10.1 (Vacuum System Lock-Up).
|
|
6.14 - Edwards EB3 Electron Beam Evaporator
|
|
00
01
02
03
04
05
06
07
08
|
3/03
7/04
7/05
10/06
1/07
4/07
10/07
5/08
9/08
|
J.-S. Hung
J. Donnelly
R. Hamilton
W. Flounders
W. Flounders
R. Hamilton
J. Morford
J. Morford
R. Hamilton
|
N/A
N/A
N/A
- Added note on grease in Sections 9.14 and 8.4.
- Added four informational paragraphs from Poco Graphite as Section 10.11 – Crucibles.
- Added
info in Sections 3.0 – Scope and 9.16 about LN trap
- Changed
Section 5.5 and added new section after 9.27..
- Changed
Section 9.2.
- Added
Note in subsections 5.8 and 9.17.
|
|
6.15 -
ULTEK E-Beam Evaporator
|
|
00
01
|
1/07
1/07
|
C. Keller
W. Flounders
|
- Re-write
of chapter.
- Added four informational paragraphs from Poco Graphite as Section 10.11 – Crucibles.
|
|
6.17 - MBE2
Manual
|
|
N/A
|
1/01
|
R.
Klockenbrink,
H. Sohn, P.
Specht, R. Zhao
|
N/A
|
|
6.20 –
CVD Thin Films
|
|
6.22 -
Parylene
Deposition System 2010 Labcoter 2
|
|
00
01
02
03
04
05
|
8/00
3/03
7/03
8/04
5/05
10/06
|
M. Wasilik
E. Kim
R. Prohaska
E. Kim
R. Hamilton
M. Wasilik
|
N/A
N/A
N/A
N/A
N/A
- Added schematic with feedback block diagram;
updated cold trap operation instructions.
|
|
6.23 -
AMST Molecular Vapor Deposition System MVD100
|
|
00
01
02
03
04
05
06
|
1/05
5/05
3/06
2/07
10/07
10/07
3/08
|
J. Chang
W. Flounders
M. Wasilik
W. Flounders
W. Flounders
M. Wasilik
M. Wasilik
|
N/A
N/A
- VUV lamp
assembly
- Added 10.6
To restart AMST Section in Troubleshooting Guidelines.
- Swapped
values in lines 1 and 2 in subsections 12.1 and 12.2
1) Paragraph added
at the end of
Section 2.0 – Purpose.
2) Section 8.4
added.
3) Addition of some
points in VUV Lamp Assembly.
4) Added Figures 2
and 3.
5) Changes in Vapor Order and in description of Appendices 12.1 and
12.2.
N/A
|
|
6.28 -
P5000 MOS/Non-MOS Clean TEOS PECVD & ThCVD System (4" and 6")
|
|
00
01
|
3/04
5/07
|
S. Parsa, J.
Chang
J. Chang
|
N/A
- Moved
subsection 9.3.6 (“Touch the SYSTEM…”) to 9.3.10.
|
|
6.29 -
Oxford Plasmalab 80plus PECVD System
|
|
00
01
02
03
|
2/05
10/05
6/08
7/08
|
J. Chang
M. Leullier
P. Monadgemi
J. Chang
|
N/A
- Added references to manuals in the Applicable
Documents section.
- Added
recipe for amorphous silicon in the appendices.
- Minor
revisions.
|
|
6.30 -
Plasma Quest ECR PECVD System
|
|
N/A
|
N/A
|
N/A
|
N/A
|
|
6.31 –
Ion Beam Deposition System (4” and 6”)
|
|
00
|
7/07
|
M. Chan, D.
Jones, D. Myers
|
- Initial
write-up of the chapter.
|