Rev.
No.
|
Date
|
Authors
|
Description
of Revision
|
8.0
Electrical Measurements
|
|
8.01 Four-Point Probe Resistivity Measurement
|
|
00
01
|
6/04
4/07
|
J. Chang
D. Queen
|
N/A
- Formatting and
grammatical changes.
|
|
8.02 Surface Charge Analyzer (SCA)
|
|
|
|
|
|
|
8.03 I-V Probe Station
|
|
00
01
02
03
|
1/93
1/96
12/04
4/07
|
R. Rudell,
S. Fang
K. Williams
B. Stoeber
D. Queen
|
N/A
N/A
N/A
- Equipment list
updated.
|
|
8.04 General Probe Station (probe145)
|
|
00
01
|
8/05
5/08
|
A. Horvath
D. Queen
|
N/A
- Reviewed no
changes.
|
|
8.05 Electroglas Autoprobe in DCL (autoprobe)
|
|
|
|
|
|
|
8.10 - Profilometers
|
|
8.11 Alpha-Step IQ Surface Profiler
|
|
|
|
|
|
|
8.12 Dektak Profilometer
|
|
00
01
|
9/03
4/07
|
X. Meng
X. Meng, D.
Queen
|
N/A
- Both authors
reviewed the chapter No changes necessary
|
|
8.13 Wyko
NT3300 Profiling System
|
|
00
01
02
|
7/02
9/05
5/08
|
M. Helmbrecht
M. Helmbrecht
M. Helmbrecht
|
N/A
N/A
- Reviewed Minor
changes. Replaced Figure 1 photo.
|
|
8.14 DI AFM Nanoscope Dimension 3100: Atomic Force
Microscope
|
|
00
01
|
8/03
12/07
|
R. Prohaska
Y.-C. Tseng
|
N/A
1) Changed Section
1.0 to Title, Ownership & Training and added a paragrah.
2) Modified
Subsections 3.2.4 and 3.2.7.
3) Changed 1st
sentence under Section 6.0 Safety. Modified Subsection 9.1.4.
4) Added new Subsection 9.2.1 and changed
order of 9.2.3 (Start Nanoscope software
) to come
before Turn on the microscope
5) Added some
precautions in 9.5.1 and 9.5.5.
6) Added new
Section 9.10 Z-Offset. Minor corrections throughout the chapter.
|
|
8.20 Microscopes/Optical
|
|
8.21 Reichert Inspection Microscope
|
|
00
01
|
11/05
8/08
|
D. Bucher
D. Queen
|
- Complete rewrite of previous manual by R. Doering (11/99) and C. Keller (2/01).
- Cosmetic changes.
|
|
8.22 Linewidth
Measuring System
|
|
00
01
|
6/06
4/07
|
D. Pestal, D. Queen
D. Pestal
|
- Initial write-up.
- Added or changed
info in Sections: 8.2 Image Capture, 9.1 Startup Subsections 9.1.4-9.1.7,
9.3 Image
Capture, and a few lines at the beginning of 9.4 Measure Menu.
|
|
8.23 UVScope
|
|
00
01
|
3/01
3/07
|
J. Chang, S. Parsa
K. Chan
|
N/A
- Changed log in and password. Changed file transfer and stage
moving procedures.
|
|
8.24
Memscope
|
|
|
|
|
|
|
8.25 Computer Microvision
System
|
|
|
|
|
|
|
8.30 Thin Film
Measurements
|
|
8.31 Rudolph Ellipsometer
|
|
00
01
02
|
11/02
9/05
5/08
|
J. Chang
J. Chang
D. Queen
|
N/A
- Reversed Sections 9.2.8 and 9.2.9, and made some minor changes.
- Reviewed no changes.
|
|
8.32 Ellipsometer (sopra)
|
|
00
01
02
|
11/04
7/07
3/08
|
H. Takeuchi
E. Stateler,
Y. Ben
D. Queen
|
- Major re-write to update operational procedures for the latest
software updates.
- Changed current
to previous in subsection 9.4.6.1.
- Included a
troubleshooting section for the singular matrix error during data analysis
and recommended
that at 100 nm oxide coated wafer be used for the calibration.
|
|
8.33 Nanospec Film Thickness
Measurement System (nanospec)
|
|
00
01
|
11/04
4/07
|
J. Chang
D. Queen
|
N/A
- Minor grammatical
updates.
|
|
8.34 Nanometrics 210 XP Scanning
UV Nanospec/DUV Microspectrophotometer
(nanoduv)
|
|
|
|
|
|
|
8.35 Film Tek Thin Film Measurement
|
|
00
01
|
3/03
9/07
|
R. Su
D. Queen
|
N/A
- Reviewed No
changes.
|
|
8.40 E-Beam/X-Ray
|
|
8.41 Jeol 6400 SEM and Nanometer Pattern Generator System
|
|
|
|
|
|
|
8.42 Leo SEM
|
|
00
01
02
03
04
|
8/99
9/05
11/05
12/05
10/07
|
J. Kedzierski
E. Stateler
K. Voros
K. Voros
E. Stateler
|
N/A
N/A
- Addition of Appendix C: Nanometrologys Initial Magnification Calibration Analysis (pdf)
- Addition of new reservation policy.
- Deletion
of cdsem (Hitachi)
and SEM (Mat. Sci. & Engg. Dept.) info in
Section Other SEMs Available.
|
|
8.44 Siemens D5000 X-Ray Diffractometer
|
|
00
01
|
12/03
4/07
|
R. Prohaska
E. Stateler
|
N/A
- Minor
modifications and addition of a paragraph in subsection 10.4.
|
|
8.50 Others
|
|
8.51 Sartorius A200S Electronic Analytical Balance
|
|
00
01
|
7/05
8/08
|
D. Bucher
D. Queen
|
- Complete re-write of previous pages: 8/92,
R. O'Donnell, J. Hutchinson.
- Reviewed No changes.
|
|
8.52 Flexus Thin Film Stress
Measurement
|
|
00
01
02
|
1/04
8/04
4/07
|
J. Chang
E. Kim
D. Queen
|
N/A
N/A
- Removed reference
to M: drive connecting the Win 3.1 computer to Silicon in Section 9.3.7
|
|
8.53 Tensiometer (KSV Sigma 701)
|
|
00
01
|
7/02
6/07
|
W. Holtz
D. Queen
|
N/A
- Reviewed No
changes
|
|
8.54 Contact Angle Measurement System (Kruss)
|
|
00
01
02
03
04
05
|
4/00
2/06
9/06
10/07
2/08
9/08
|
T. Srinivasan
W.
Flounders
A.
Ohta
K.
Chan
D.
Pestal
D.
Queen
|
N/A
- Addition of Appendices.
- Chapter reformatted.
- Added
SSH secure file transfer instruction and minor changes.
- Added
link to Krόss
DSA (Drop Shape Analysis) Manual (pdf doc)
- Users are now to move their files from the computer via
floppy disk.
This machine is no
longer connected to the network.
|
|
8.55 FTIR In Situ Depth Monitoring System
|
|
00
01
|
5/05
6/08
|
M. Wasilik,
S. Bosch-Charpenay,
N. Chen
M. Wasilik
|
N/A
- Reviewed No
changes.
|