Rev.
No.
|
Date
|
Authors
|
Description
of Revision
|
8.0
– Electrical Measurements
|
|
8.01 – Four-Point Probe Resistivity Measurement
|
|
00
01
02
|
6/04
4/07
8/09
|
J. Chang
D. Queen
D. Queen
|
N/A
Formatting and grammatical changes.
Reviewed. No changes.
|
|
8.02 – Surface Charge Analyzer (SCA)
|
|
00
01
02
|
12/02
2/07
7/09
|
J. Chang
J. Lai
L. Petho
|
N/A
N/A
Reviewed. No changes.
|
|
8.03 – I-V Probe Station
|
|
00
01
02
03
04
|
1/93
1/96
12/04
4/07
9/09
|
R. Rudell,
S. Fang
K. Williams
B. Stoeber
D. Queen
L. Petho
|
N/A
N/A
N/A
Equipment list updated.
Reviewed. No changes.
|
|
8.04 – General Probe Station (probe145)
|
|
00
01
|
8/05
5/08
|
A. Horvath
D. Queen
|
N/A
Reviewed. No changes.
|
|
8.05 – Electroglas Autoprobe in DCL (autoprobe)
|
|
00
01
|
10/06
1/09
|
S. Parsa, T.
Merport
L. Petho
|
Major rewrite to take into account
all software/hardware upgrades.
Updated hardware and wafer setup procedures
in subparagraphs 9.1.10, 11, 17, 24, 30,& 33.
|
|
8.10 - Profilometers
|
|
8.11 – Alpha-Step IQ Surface Profiler
|
|
00
01
02
03
04
05
|
4/03
8/04
5/05
9/05
3/06
10/08
|
E. Kim, M.
Wasilik
E. Kim
M. Wasilik
M. Wasilik
M. Wasilik
M. Wasilik
|
N/A
N/A
N/A
N/A
Revised Figure 2 and added
Figure 3.
Specifications extended and
Section 8.1 - Surface Roughness Measurements added.
|
|
8.12 – Dektak Profilometer
|
|
00
01
02
|
9/03
4/07
8/09
|
X. Meng
X. Meng, D.
Queen
D. Queen
|
N/A
Both authors reviewed the chapter – No changes necessary
Reviewed. No changes.
|
|
8.13 – Wyko NT3300 Profiling System
|
|
00
01
02
|
7/02
9/05
5/08
|
M. Helmbrecht
M. Helmbrecht
M. Helmbrecht
|
N/A
N/A
Reviewed – Minor changes. Replaced Figure 1 photo.
|
|
8.14 – DI AFM Nanoscope Dimension 3100: Atomic Force
Microscope
|
|
00
01
|
8/03
12/07
|
R. Prohaska
Y.-C. Tseng
|
N/A
1) Changed Section
1.0 to Title, Ownership & Training and added a paragrah.
2) Modified
Subsections 3.2.4 and 3.2.7.
3) Changed 1st
sentence under Section 6.0 – Safety. Modified Subsection 9.1.4.
4) Added new Subsection 9.2.1 and changed
order of 9.2.3 (Start Nanoscope software…) to come
before Turn on the microscope…
5) Added some
precautions in 9.5.1 and 9.5.5.
6) Added new Section
9.10 – Z-Offset. Minor corrections throughout the chapter.
|
|
8.20 – Microscopes/Optical
|
|
8.21 – Reichert Inspection Microscope
|
|
00
01
|
11/05
8/08
|
D. Bucher
D. Queen
|
Complete rewrite of
previous manual by R. Doering (11/99) and C. Keller
(2/01).
Cosmetic changes.
|
|
8.22 – Linewidth
Measuring System
|
|
00
01
|
6/06
4/07
|
D. Pestal,
D. Queen
D. Pestal
|
Initial write-up.
Added or
changed info in Sections: 8.2 – Image Capture, 9.1 – Startup Subsections
9.1.4-9.1.7,
9.3 – Image Capture, and a few lines at the
beginning of 9.4 – Measure Menu.
|
|
8.23 – UVScope
|
|
00
01
02
|
3/01
3/07
7/09
|
J. Chang, S. Parsa
K. Chan
K. Chan
|
N/A
Changed
log in and password. Changed file transfer and stage moving procedures.
Changed
font size, added space between line and log off sentence.
|
|
8.24
– Memscope
|
|
00
01
|
5/06
1/09
|
A. De La
Fuente
D. Soltman
|
N/A
Added
Section 10.2. Checked, all in order.
|
|
8.25 – Computer Microvision
System
|
|
|
|
|
|
|
8.30 – Thin Film
Measurements
|
|
8.31 – Rudolph Ellipsometer
|
|
00
01
02
|
11/02
9/05
5/08
|
J. Chang
J. Chang
D. Queen
|
N/A
Reversed Sections 9.2.8 and
9.2.9, and made some minor changes.
Reviewed. No changes.
|
|
8.32 – Ellipsometer (sopra)
|
|
00
01
02
03
|
11/04
7/07
3/08
3/09
|
H. Takeuchi
E. Stateler,
Y. Ben
D. Queen
D. Queen
|
Major re-write to update operational procedures for the
latest software updates.
Changed “current” to “previous” in subsection 9.4.6.1.
- Included a troubleshooting
section for the singular matrix error during data analysis
and
recommended that at 100 nm oxide coated wafer be used for the calibration.
Added the Appendix.
|
|
8.33 – Nanospec Film Thickness
Measurement System (nanospec)
|
|
00
01
02
|
11/04
4/07
8/09
|
J. Chang
D. Queen
D. Queen
|
N/A
Minor
grammatical updates.
Reviewed.
No changes.
|
|
8.34 – Nanometrics
210 XP Scanning UV – Nanospec/DUV Microspectrophotometer (nanoduv)
|
|
00
01
02
|
1/05
5/06
4/09
|
J. Chang
J. Chang
J. Chang
|
N/A
Added
special instructions for UV programs.
Reviewed.
No changes.
|
|
8.35 – Film Tek Thin Film
Measurement
|
|
00
01
02
|
3/03
9/07
8/09
|
R. Su
D. Queen
D. Queen
|
N/A
Reviewed. No changes.
Reviewed. No changes.
|
|
8.40 – E-Beam/X-Ray
|
|
8.41 – Jeol 6400 SEM and Nanometer Pattern Generator System
|
|
|
|
|
|
|
8.42 – Leo SEM
|
|
00
01
02
03
04
05
|
8/99
9/05
11/05
12/05
10/07
8/09
|
J. Kedzierski
E. Stateler
K. Voros
K. Voros
E. Stateler
L. Petho
|
N/A
N/A
Addition
of Appendix C: Nanometrology’s Initial Magnification Calibration Analysis (pdf)
Addition
of new reservation policy.
Deletion of cdsem (Hitachi) and SEM (Mat.
Sci. & Engg. Dept.) info
in Section Other SEMs Available.
Reviewed. Minor editing throughout the text.
|
|
8.44 – Siemens D5000 X-Ray Diffractometer
|
|
00
01
02
03
|
12/03
4/07
9/08
7/09
|
R. Prohaska
E. Stateler
E. Stateler
C. Zhao
|
N/A
Minor modifications and addition of a paragraph in
subsection 10.4.
Added a sentence at the end of subsection 6.2.
Minor addition in Section 2.0. Addition of paragraph 10.5
in Troubleshooting Section.
|
|
8.50 – Others
|
|
8.51 – Sartorius A200S Electronic Analytical Balance
|
|
00
01
|
7/05
8/08
|
D. Bucher
D. Queen
|
Complete re-write of previous
pages: 8/92, R. O'Donnell, J. Hutchinson.
Reviewed. No changes.
|
|
8.52 – Flexus Thin Film Stress
Measurement
|
|
00
01
02
03
|
1/04
8/04
4/07
8/09
|
J. Chang
E. Kim
D. Queen
D. Queen
|
N/A
N/A
Removed reference to M: drive connecting the Win 3.1
computer to Silicon in Section 9.3.7.
Reviewed. No changes.
|
|
8.53 – Tensiometer (KSV Sigma
701)
|
|
00
01
02
|
7/02
6/07
8/09
|
W. Holtz
D. Queen
D. Queen
|
N/A
Reviewed. No changes.
Reviewed. No changes.
|
|
8.54 – Contact Angle Measurement System (Kruss)
|
|
00
01
02
03
04
05
06
07
|
4/00
2/06
9/06
10/07
2/08
9/08
7/09
9/09
|
T. Srinivasan
W.
Flounders
A.
Ohta
K.
Chan
D.
Pestal
D.
Queen
K.
Voros
K.
Chan
|
N/A
Addition of Appendices.
Chapter reformatted.
Added SSH secure file transfer
instruction and minor changes.
Added link to Krüss DSA (Drop Shape
Analysis) Manual (pdf doc)
- Users are now to move their files from the computer via
floppy disk.
This machine is no
longer connected to the network.
Removed link to Krüss Drop
Shape Analysis (DSA) Manual in Section 4.0.
Reviewed. No changes.
|
|
8.55 – FTIR In Situ Depth Monitoring System
|
|
00
01
|
5/05
6/08
|
M. Wasilik,
S. Bosch-Charpenay,
N. Chen
M. Wasilik
|
N/A
Reviewed. No changes.
|