Lab Members
Update January 6, 2004
432D is being restaged.
technics-a and technics-b have been moved to room 432 and will become part of a
PECVD cluster, which includes oxford2. disco will be moved across the room.
The former location of disco will become lab member storage. A replacement for
sinkplate is being sought. A new HEPA filter has been installed in the ceiling
of 432D. A GCA 8500 stepper is
slated to replace gcaws1. gcaws6 is a 5x I-line 6 stepper with a .35 na, 22 mm
field size and automated reticle management.
gcaws6 replaces gcaws1. Lab members with 4 wafers and 10X masks currently
using gcaws1 will have gcaws2 available for use. Installation is slated for the
March/April timeframe. Install will interrupt the use of gcaws2 for up to one
week. A final date will be announced several weeks before work proceeds.
Members that plan on 6 substrates and i-line stepper capability are encouraged
to develop and submit their new mask jobs. Edwards, the
FANUC-donated sputter system is available for use in GL2 in the DC sputter
mode. The rf power supply is not
yet available. Advantages of the Edwards are user-changeable targets and the
small target diameter (~3), which reduces the cost of targets. We currently
have Au, Cu, Ni, and Pt targets available. The Au and Pt targets must be
checked out from the office. Use will be charged by weight loss. A Karl Suss model FC150
flip-chip bonder is slated for installation in Y1. This will require moving
mask storage and rearranging the tools in Y1. A new mask storage area will be
created in the solid red wall panel, which borders the hallway, opposite Y1. The
Cory Hall Machine Shop is fabricating a 4 x 6 set of shelves to hold lab
member mask boxes. We have not yet gained possession of flipchip. If all goes
well estimated installation date is end of February Fanuc-donated
PECVD system. oxford2 will be tested with standard PECVD oxide and nitride. It
offers the advantage of 425C platen temperature and a dual frequency plasma
source for stress adjustment. Under
test for TEOS oxide and boron-doped (source = TEB) oxide. Not released for
general use at present. SINK4 A new FANUC-donated sink4 will be installed January
14. Installation will take 1-2 days. The area open for use but may be difficult
to use during installation. SINK9 sink9 will soon be
dedicated for ultra clean use. A dedicated srd stack (sink9srd) will be
installed. Installation should begin sometime late in January. A
Fanuc-donated CEE model 100 spinner will replace the former spinner2. The
worktables that currently accommodate spinner1 and the area adjacent to it will
be modified to accommodate spinner2 and an experimental resist setup. The final
height from the floor of spinner1 and spinner2 will be lower than at present
for better ergonomics. A new SVG 8600 series 6
coat track has been purchased and will be sighted in Y1. svgcoat3 resembles
svgcoat1 and svgcoat2. At present it will be configured with thick-PR and
backside EBR with the ability to add additional dispense when need. TECHNICS-A/B Moved to 432. A new gas
control system as well as a new pressure control is being completed. TYSTAR14 (solid source
boron) A 6 boat and 6 solid
source wafers for doping up to 1125 C are Sia Parsa
//-->
. TYSTAR20 BCL3 .1%/bal. Helium will
be added to tystar20. It replaces the PH3 dopant. Tystar20 will be down ~ 2day to complete this install. PIRANHA/ACID
WASTE DISPOSAL The installation of an acid waste
neutralization system is in progress. This system assures Cory Hall meets
environmental regulations. Once installed piranha disposal will be simplified. CHEMICAL
INVENTORY The chemical inventory for the
Microlab was updated as required by EH&S. The Microlab chemical inventories
are up-to-date. CHP
UPDATE An EH&S-style Chemical
Hygiene Plan has been posted in Microlab rooms 107, 190, 218 and 420 as
required by Campus EH&S. In addition, the IML version of this CHP covers
Microlab rooms 161 and 163. These documents are supplemental to the more robust
Microlab CHP which is available online at: http://microlab.berkeley.edu/labmanual/chap1/1.2.html A PC with thermal printer
has been placed in AN3, next to the telephone. This PC/printer is capable of
high speed printing on 3 x 2 label stock with non-permanent adhesive. A set of
instructions resides by the printer. Lab members are encouraged to label their
frock, masks and wafers using this labeler. RH
6/12/04
Equipment & Process Updates
CENTURA
Microlab
has completed Tier 0 (plumb and site tool) and Microlab and AMAT have completed
Tier I (all facilities operational, all tool mechanical and electrical
operational, all gas lines N2 tested, all wafer handling verified and aligned
no process test) of the Centura etcher install. AMAT engineers have now
commenced Tier 2 - base process verification.
At present there is an issue with the end-point system.
DISCO & SINKPLATE
GAWS6
EDWARDS
FLIPCHIP
OXFORD2
P5000
SPINNER2
SVGCOAT3
now available for B+ doping in
tystar14. If you are interested in using the new boat please e-mail lSafety
LABELER