Microlab Lab Manual

Chapter 1 – General Information / Processing

1.1 Table of Contents

1.2 Chemical Hygiene Plan (Safety Rules & Procedures)

1.3 Process Modules

1.4 CMOS Process (4", 1.3 µm)

1.5 CMOS Processes on 6” Wafers:

1.51 CMOS Process (1 µm)

1.52 CMOS Process (0.35 µm)

1.6 Substrate Specifications & Wafer Identification

1.7 Material & Process Compatibility Policy

1.8 Compatibility of Microlab Tools with 4" and 6" Substrates

1.9 VLSI Etchants

1.10 Miscellaneous Etchants

1.11 Miscellaneous Plating Solutions

1.12 Material Safety Data Sheets (MSDS)

1.13 How to Write a Lab Manual Chapter

1.14

1.15 Orientation Notes

1.16 Laboratory Guide

Chapter 2 - Cleaning Procedures

2.1 General Cleaning Procedures

2.2 Tystar and Lam Monitor Wafer Preparation and Rework

2.3 Sink3 Operation

2.4 Sink4 Operation

2.5 Sink5 (Y2)

2.6 Sink6 (MOS Clean)

2.7 Sink7 (VLSI)

2.8 Sink8 (Non-MOS Clean)

2.9 Sink9 Operation

2.10 Old Lab Sinks Operation (432C sink and black utility sink)

2.11 Sink 432A (Old Lab)

2.12 Sinkplate - Electroplating

2.13 Tousimis 815 Critical-Point Dryer (small samples)

2.14 Tousimis 915B Critical-Point Dryer

Chapter 3 - Mask Making

3.1 Mask Generation Using CAD Software

3.2 GCA Wafer Stepper Alignment Key Design Guide

3.3 GCA 3600 Pattern Generator

3.4 APT Emulsion Mask Process

3.5 APT Chrome Mask Process

3.6 Iron Oxide Masks Processing

3.7 Ultratech Mask Copier

3.8 CMOS Baseline Test Chip

Chapter 4 – Photolithography

4.00 – General Resist Parameters

4.10 – Exposure Tools

4.11 ASML DUV Stepper Model 5500/90 (6”) (asml)

4.12 GCA 8500 Wafer Stepper (6”) (gcaws6)

4.13 GCA 6200 Wafer Stepper (4”) (gcaws2)

4.14 Karl Suss MA6 Mask Aligner (ksaligner)

4.15 Canon 4X Projection Mask Aligner (canon)

4.16 Quintel Q4000 Mask Aligner (quintel)

4.17 JEOL 6400 SEM & Nanometer Pattern Generation System (jeol107)

4.18 Crestec CABL-9510CC High Resolution Electron Beam Lithography System (crestec)

4.20 – Resist Treatment

4.21 SVG 8626 Photoresist Coat Track (6”) (svgcoat1)

4.22 SVG 8626 Photoresist Coat Track (4”) (svgcoat2)

4.23 SVGG-1 Photoresist Coat Track (4”) (svgcoat3)

4.24 SVG 8800 Coat Track (6”) (svgcoat6)

4.25 SVGDEV Photoresist Development Tracks (4”) (svgdev)

4.26 SVG 8800 Develop Track (6”) (svgdev6)

4.27 UVBAKE – Fusion M150PC Photostabilizer System (uvbake)

4.28 Matrix 106 Resist Removal System (asher)

4.29 HMDS (Primeoven & Sink4 HMDS)

4.30 Headway Photoresist Spinner (spinner1)

4.40 – Others

4.41 Mix & Match Process

4.42 Photomask Cleaning (sink12 photomask cleaning station)

Chapter 5 - Diffusion Furnaces/Ovens

5.0 Tystar/Tylan Furnaces Overview

5.1 Tystar1 MOS Clean Gate Oxidation Atmospheric Furnace (4" and 6")

5.2 Tystar2 MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6")

5.3 Tystar3 Non-MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6")

5.4 Tystar4 Non-MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6")

5.5 Tylan5 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric Furnace (4” Only)

5.6 Tylan6 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric Furnace (4” Only)

5.7 Tylan7 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric Furnace (4” Only)

5.8 Tylan8 Compound Semiconductor Oxidation Furnace (1 cm Only)

5.9 Tystar9 MOS Clean Silicon Nitride (Si3N4) LPCVD Furnace (4" and 6")

5.10 Tystar10 MOS Clean Polycrystalline Silicon LPCVD Furnace (4" and 6")

5.11 Tystar11 MOS Clean LTO LPCVD Furnace (4" and 6")

5.12 Tystar12 Non-MOS Clean LTO LPCVD Furnace (4" and 6")

5.13 Tystar13 Non-MOS Clean POCl3 Doping Furnace (4" and 6")

5.14 Tystar14 Boron+ Doping Furnace

5.15 Tystar15 Non-MOS Polysilicon Carbide LPCVD Furnace

5.16 Tystar16 Non-MOS LPCVD Furnace

5.17 Tystar17 Non-MOS Low Stress Nitride and High Temperature Oxide LPCVD Furnace (4" and 6")

5.18 Tystar18 MOS Clean Aluminum Sintering Atmospheric Furnace (4" and 6")

5.19 Tystar19 MOS Clean Si-Ge LPCVD Furnaces (4" and 6" )

5.20 Tystar20 Non-MOS Clean Si-Ge LPCVD Furnace (4" and 6")

5.30 Contamination Monitoring of MOS-Clean Furnaces

5.31 Heatpulse1 - Rapid Thermal Annealing with Healpulse 210T RTA System

Microlab Lab Manual

Table of Contents

Chapter 1 – General Information / Processing

2.1 General Cleaning Procedures

2.2 Tystar and Lam Monitor Wafer Preparation and Rework

2.3 Sink3 Operation

2.4 Sink4 Operation

2.5 Sink5 (Y2)

2.6 Sink6 (MOS Clean)

2.7 Sink7 (VLSI)

2.8 Sink8 (Non-MOS Clean)

2.9 Sink9 Operation

2.10 Old Lab Sinks Operation (432C sink and black utility sink)

2.11 Sink 432A (Old Lab)

2.12 Sinkplate - Electroplating

2.13 Tousimis 815 Critical-Point Dryer (small samples)

2.14 Tousimis 915B Critical-Point Dryer

3.1 Mask Generation Using CAD Software

3.2 GCA Wafer Stepper Alignment Key Design Guide

3.3 GCA 3600 Pattern Generator

3.4 APT Emulsion Mask Process

3.5 APT Chrome Mask Process

3.6 Iron Oxide Masks Processing

3.7 Ultratech Mask Copier

3.8 CMOS Baseline Test Chip

4.00 – General Resist Parameters

Chapter 5 - Diffusion Furnaces/Ovens

5.0 Tystar/Tylan Furnaces Overview

5.1 Tystar1 MOS Clean Gate Oxidation Atmospheric Furnace (4" and 6")

5.2 Tystar2 MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6")

5.3 Tystar3 Non-MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6")

5.4 Tystar4 Non-MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6")

5.5 Tylan5 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric Furnace (4” Only)

5.6 Tylan6 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric Furnace (4” Only)

5.7 Tylan7 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric Furnace (4” Only)

5.8 Tylan8 Compound Semiconductor Oxidation Furnace (1 cm Only)

5.9 Tystar9 MOS Clean Silicon Nitride (Si3N4) LPCVD Furnace (4" and 6")

5.10 Tystar10 MOS Clean Polycrystalline Silicon LPCVD Furnace (4" and 6")

5.11 Tystar11 MOS Clean LTO LPCVD Furnace (4" and 6")

5.12 Tystar12 Non-MOS Clean LTO LPCVD Furnace (4" and 6")

5.13 Tystar13 Non-MOS Clean POCl3 Doping Furnace (4" and 6")

5.14 Tystar14 Boron+ Doping Furnace

5.15 Tystar15 Non-MOS Polysilicon Carbide LPCVD Furnace

5.16 Tystar16 Non-MOS LPCVD Furnace

5.17 Tystar17 Non-MOS Low Stress Nitride and High Temperature Oxide LPCVD Furnace (4" and 6")

5.18 Tystar18 MOS Clean Aluminum Sintering Atmospheric Furnace (4" and 6")

5.19 Tystar19 MOS Clean Si-Ge LPCVD Furnaces (4" and 6" )

5.20 Tystar20 Non-MOS Clean Si-Ge LPCVD Furnace (4" and 6")

5.30 Contamination Monitoring of MOS-Clean Furnaces

5.31 Heatpulse1 - Rapid Thermal Annealing with Healpulse 210T RTA System

5.32 Heatpulse2 - Rapid Thermal Annealing with Healpulse 210T RTA System

5.33 Heatpulse3 - MOS Clean Rapid Thermal Annealing System

5.34 Heatpulse4 - MOS and Non-MOS Rapid Thermal Annealing System

5.35 Nanox Atmospheric Furnace for Growing Carbon Nanotubes

5.36 YES Vacuum Furnace (Polymide Curing and Annealing Furnace)

5.40 Plasma Immersion Ion Implantation (PIII) System

6.00 – Sputterers

6.01 Hummer Sputtering System (for SEM samples ONLY)

6.02 Novellus m2i Sputtering System

6.03 Randex System

6.04 CPA Sputtering System

6.05

6.06

6.07 Edwards Auto 306 DC and RF Sputter Coater

6.08 AMS Aluminum Nitride

6.10 – Evaporators

6.11 NRC Evaporator

6.12 Veeco 401 Vacuum System

6.13

6.14 Edwards EB3 Electron Beam Evaporator

6.15 ULTEK E-Beam Evaporator

6.20 – CVD Thin Films

6.21

6.22 Parylene Deposition System 2010 Labcoter 2

6.23 AMST Molecular Vapor Deposition System MVD100

6.24 Picosun Atomic Layer Deposition (ALD)

6.25

6.26

6.27

6.28 P5000 MOS/Non-MOS Clean TEOS PECVD & ThCVD System (4" and 6")

7.6 Centura^®MxP+ Chamber

7.7 Centura^® Deep Silicon Etch DPS-DT

7.12 Centura^®Metal Chamber