Microlab Lab Manual

Table of Contents

Chapter 1 – General Information / Processing

1.1

1.2 Chemical Hygiene Plan (Safety Rules & Procedures) - Moved to Marvell Nanofabrication Lab

1.3 Process Modules - Moved to Marvell Nanofabrication Lab

1.4

1.5 CMOS Processes on 6” Wafers:

1.51

1.52 CMOS Process (0.35 µm) - Moved to Marvell Nanofabrication Lab

1.6 Substrate Specifications & Wafer Identification - Moved to Marvell Nanofabrication Lab

1.7 Material & Process Compatibility Policy - Moved to Marvell Nanofabrication Lab

1.8

1.9 VLSI Etchants - Moved to Marvell Nanofabrication Lab

1.10 Miscellaneous Etchants - Moved to Marvell Nanofabrication Lab

1.11 Miscellaneous Plating Solutions - Moved to Marvell Nanofabrication Lab

1.12 Material Safety Data Sheets (MSDS) - Moved to Marvell Nanofabrication Lab

1.13

1.14

1.15

1.16

Chapter 2 - Cleaning Procedures

2.1 General Cleaning Procedures - Moved to Marvell Nanofabrication Lab

2.2 Tystar and Lam Monitor Wafer Preparation and Rework - Moved to Marvell Nanofabrication Lab

2.3 Sink3 Operation - Moved to Marvell Nanofabrication Lab

2.4

2.5

2.6 Sink6 (MOS Clean) - Moved to Marvell Nanofabrication Lab

2.7 Sink7 (VLSI) - Moved to Marvell Nanofabrication Lab

2.8 Sink8 (Non-MOS Clean) - Moved to Marvell Nanofabrication Lab

2.9

2.10

2.11

2.12 Sinkplate - Electroplating - Moved to Marvell Nanofabrication Lab

2.13 Tousimis 815 Critical-Point Dryer (small samples) - Moved to Marvell Nanofabrication Lab

2.14 Tousimis 915B Critical-Point Dryer - Moved to Marvell Nanofabrication Lab

Chapter 3 - Mask Making

3.1 Mask Generation Using CAD Software - Moved to Marvell Nanofabrication Lab

3.2 GCA Wafer Stepper Alignment Key Design Guide - Moved to Marvell Nanofabrication Lab

3.3 GCA 3600 Pattern Generator - Moved to Marvell Nanofabrication Lab

3.4 APT Emulsion Mask Process - Moved to Marvell Nanofabrication Lab

3.5 APT Chrome Mask Process - Moved to Marvell Nanofabrication Lab

3.6 Iron Oxide Masks Processing - Moved to Marvell Nanofabrication Lab

3.7 Ultratech Mask Copier - Moved to Marvell Nanofabrication Lab

3.8 CMOS Baseline Test Chip - Moved to Marvell Nanofabrication Lab

Chapter 4 – Photolithography

4.00 – General Resist Parameters - Moved to Marvell Nanofabrication Lab

4.10 – Exposure Tools

4.11 ASML DUV Stepper Model 5500/90 (6”) (asml) - Replaced by Model 5500/300

4.12 GCA 8500 Wafer Stepper (6”) (gcaws6) - Moved to Marvell Nanofabrication Lab

4.13 GCA 6200 Wafer Stepper (4”) (gcaws2) - Moved to Marvell Nanofabrication Lab

4.14 Karl Suss MA6 Mask Aligner (ksaligner) - Moved to Marvell Nanofabrication Lab

4.15 Canon 4X Projection Mask Aligner (canon) - Moved to Marvell Nanofabrication Lab

4.16 Quintel Q4000 Mask Aligner (quintel) - Moved to Marvell Nanofabrication Lab

4.17 JEOL 6400 SEM & Nanometer Pattern Generation System - Moved to Marvell Nanofabrication Lab

4.18 Crestec E-Beam Lithography System (crestec) - Moved to Marvell Nanofabrication Lab

4.20 – Resist Treatment

4.21 SVG 8626 Photoresist Coat Track (6”) (svgcoat1) - Moved to Marvell Nanofabrication Lab

4.22 SVG 8626 Photoresist Coat Track (4”) (svgcoat2) - Moved to Marvell Nanofabrication Lab

4.23 SVGG-1 Photoresist Coat Track (4”) (svgcoat3) - Moved to Marvell Nanofabrication Lab

4.24 SVG 8800 Coat Track (6”) (svgcoat6) - Moved to Marvell Nanofabrication Lab

4.25 SVGDEV Photoresist Development Tracks (4”) (svgdev) - Moved to Marvell Nanofabrication Lab

4.26 SVG 8800 Develop Track (6”) (svgdev6) - Moved to Marvell Nanofabrication Lab

4.27 UVBAKE – Fusion M150PC Photostabilizer System (uvbake) - Moved to Marvell Nanofabrication Lab

4.28 Matrix 106 Resist Removal System (asher) - Moved to Marvell Nanofabrication Lab

4.29 HMDS (Primeoven & Sink4 HMDS) - Moved to Marvell Nanofabrication Lab

4.30 Headway Photoresist Spinner (spinner1) - Moved to Marvell Nanofabrication Lab

4.40 – Others

4.41 Mix & Match Process - Moved to Marvell Nanofabrication Lab

4.42 Photomask Cleaning (sink12 photomask cleaning station) - Moved to Marvell Nanofabrication Lab

Chapter 5 - Diffusion Furnaces/Ovens

5.0 Tystar/Tylan Furnaces Overview - Moved to Marvell Nanofabrication Lab

5.1 Tystar1 MOS Clean Gate Oxidation Atmospheric Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.2 Tystar2 MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.3 Tystar3 Non-MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.4 Tystar4 Non-MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.5

5.6

5.7

5.8

5.9 Tystar9 MOS Clean Silicon Nitride (Si3N4) LPCVD Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.10 Tystar10 MOS Clean Polycrystalline Silicon LPCVD Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.11 Tystar11 MOS Clean LTO LPCVD Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.12 Tystar12 Non-MOS Clean LTO LPCVD Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.13 Tystar13 Non-MOS Clean POCl3 Doping Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.14 Tystar14 Boron+ Doping Furnace - Moved to Marvell Nanofabrication Lab

5.15 Tystar15 Non-MOS Polysilicon Carbide LPCVD Furnace - Moved to Marvell Nanofabrication Lab

5.16 Tystar16 Non-MOS LPCVD Furnace - Moved to Marvell Nanofabrication Lab

5.17 Tystar17 Non-MOS Low Stress Nitride and High Temperature Oxide LPCVD Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.18 Tystar18 MOS Clean Aluminum Sintering Atmospheric Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.19 Tystar19 MOS Clean Si-Ge LPCVD Furnaces (4" and 6" ) - Moved to Marvell Nanofabrication Lab

5.20 Tystar20 Non-MOS Clean Si-Ge LPCVD Furnace (4" and 6") - Moved to Marvell Nanofabrication Lab

5.30 Contamination Monitoring of MOS-Clean Furnaces - Moved to Marvell Nanofabrication Lab

5.31 Heatpulse1 - Rapid Thermal Annealing with Healpulse 210T RTA System - Moved to Marvell Nanofabrication Lab

5.32 Heatpulse2 - Rapid Thermal Annealing with Healpulse 610T RTA System - Moved to Marvell Nanofabrication Lab

5.33 Heatpulse3 - MOS Clean Rapid Thermal Annealing System - Moved to Marvell Nanofabrication Lab

5.34 Heatpulse4 - MOS and Non-MOS Rapid Thermal Annealing System - Moved to Marvell Nanofabrication Lab

5.35 Nanox Atmospheric Furnace for Growing Carbon Nanotubes - Moved to Marvell Nanofabrication Lab

5.36 YES Vacuum Furnace (Polymide Curing and Annealing Furnace) - Moved to Marvell Nanofabrication Lab

Chapter 6 - Thin Film Systems

6.00 – Sputterers

6.01 Hummer Sputtering System (for SEM samples ONLY) - Moved to Marvell Nanofabrication Lab

6.02 Novellus m2i Sputtering System - Moved to Marvell Nanofabrication Lab

6.03 Randex System - Moved to Marvell Nanofabrication Lab

6.04 CPA Sputtering System - Moved to Marvell Nanofabrication Lab

6.05

6.06

6.07 Edwards Auto 306 DC and RF Sputter Coater - Moved to Marvell Nanofabrication Lab

6.08

6.10 – Evaporators

6.11 NRC Evaporator - Moved to Marvell Nanofabrication Lab

6.12 Veeco 401 Vacuum System - Moved to Marvell Nanofabrication Lab

6.13

6.14 Edwards EB3 Electron Beam Evaporator - Moved to Marvell Nanofabrication Lab

6.15 ULTEK E-Beam Evaporator - Moved to Marvell Nanofabrication Lab

6.20 – CVD Thin Films

6.21

6.22 Parylene Deposition System 2010 Labcoter 2 - Moved to Marvell Nanofabrication Lab

6.23 AMST Molecular Vapor Deposition System MVD100 - Moved to Marvell Nanofabrication Lab

6.24 Picosun Atomic Layer Deposition (ALD) - Moved to Marvell Nanofabrication Lab

6.25

6.26

6.27

6.28 P5000 MOS/Non-MOS Clean TEOS PECVD & ThCVD System (4" and 6") - Moved to Marvell Nanofabrication Lab

6.29 Oxford Plasmalab 80plus PECVD System - Moved to Marvell Nanofabrication Lab

6.30 Plasma Quest ECR PECVD System - Moved to Marvell Nanofabrication Lab

6.31 Ion Beam Deposition System (4” and 6”) - Moved to Marvell Nanofabrication Lab

Chapter 7 - Etching Systems

7.0

7.1

7.2

7.3

7.4

7.5 Centura^® MxP+ Chamber - Moved to Marvell Nanofabrication Lab

7.6 Centura^® Deep Silicon Etch DPS-DT - Moved to Marvell Nanofabrication Lab

7.7 STS Poly-Si ICP Etcher - Moved to Marvell Nanofabrication Lab

7.8 Plasma-Therm Parallel Plate Etcher - Moved to Marvell Nanofabrication Lab

7.9 Oxford RIE System (Restricted to CCH Group) - Moved to Marvell Nanofabrication Lab

7.10 Technics C Plasma Etching System - Moved to Marvell Nanofabrication Lab

7.11 Centura^® Metal Chamber - Moved to Marvell Nanofabrication Lab

7.12 Xenon Difluoride Etching System - Moved to Marvell Nanofabrication Lab

7.13 Ion Beam Milling with the Veeco Microetch System - Moved to Marvell Nanofabrication Lab

7.14 Hfvapor (Idonus HF VPE-100 / 150) - Moved to Marvell Nanofabrication Lab

Chapter 8 – Testing/Inspection Equipment

8.00 – Electrical Measurements

8.01 Four-Point Probe Resistivity Measurement - Moved to Marvell Nanofabrication Lab

8.02 Surface Charge Analyzer (sca) - Moved to Marvell Nanofabrication Lab

8.03 I-V Probe Station - Moved to Marvell Nanofabrication Lab

8.04 General Probe Station - Moved to Marvell Nanofabrication Lab

8.05 Electroglas Autoprobe in DCL - Moved to Marvell Nanofabrication Lab

8.10 – Profilometers

8.11 Alpha-Step IQ Surface Profiler - Moved to Marvell Nanofabrication Lab

8.12 Dektak Profilometer - Moved to Marvell Nanofabrication Lab

8.13 Wyko NT3300 Profiling System - Moved to Marvell Nanofabrication Lab

8.14 DI AFM Nanoscope Dimension 3100: Atomic Force Microscope - Moved to Marvell Nanofabrication Lab

8.20 – Microscopes/Optical

8.21 Reichert Inspection Microscope - Moved to Marvell Nanofabrication Lab

8.22 Linewidth Measuring System - Moved to Marvell Nanofabrication Lab

8.23

8.24 Memscope - Moved to Marvell Nanofabrication Lab

8.25

8.30 – Thin Film Measurements

8.31 Rudolph Ellipsometer - Moved to Marvell Nanofabrication Lab

8.32 Ellipsometer (sopra) - Moved to Marvell Nanofabrication Lab

8.33 NanosSpec Film Thickness Measurement System - Moved to Marvell Nanofabrication Lab

8.34 Nanometrics 210 XP Scanning UV - Nanospec/DUV Microspectrophotometer - Moved to Marvell Nanofabrication Lab

8.35

8.40 – E-Beam/X-Ray

8.41

8.42 Leo SEM - Moved to Marvell Nanofabrication Lab

8.43

8.44 Siemens D5000 X-Ray Diffractometer - Moved to Marvell Nanofabrication Lab

8.50 – Others

8.51 Sartorius A200S Electronic Analytical Balance - Moved to Marvell Nanofabrication Lab

8.52 Flexus Thin Film Stress Measurement - Moved to Marvell Nanofabrication Lab

8.53 Tensiometer (KSV Sigma 701) - Moved to Marvell Nanofabrication Lab

8.54 Contact Angle Measurement System (Kruss) - Moved to Marvell Nanofabrication Lab

8.55

Chapter 9 - Packaging

9.0 Bonding Tool Overview - Moved to Marvell Nanofabrication Lab

9.1 Karl Suss BA6 Bond Aligner - Moved to Marvell Nanofabrication Lab

9.2 Karl Suss SB6 Thermocompression and Anodic Bonder - Moved to Marvell Nanofabrication Lab

9.3 Suss Microtech FC150 Flip Chip Bonder - Moved to Marvell Nanofabrication Lab

9.4 Westbond Wirebonder Model 7400B - Moved to Marvell Nanofabrication Lab

9.5

9.6 Esec 8003 Dicing Saw - Moved to Marvell Nanofabrication Lab

Chapter 10 - Planarization

10.1 Chemical-Mechanical Polisher (CMP) - Moved to Marvell Nanofabrication Lab

10.2 CMP Cleaning - Moved to Marvell Nanofabrication Lab

Last Updated: 3/3/11