1.2
Chemical Hygiene Plan
(Safety Rules & Procedures)
1.3
Process Modules
1.5
CMOS Processes on 6” Wafers:
1.51 CMOS Process (1
µm)
1.6
Substrate
Specifications & Wafer Identification
1.7
Material &
Process Compatibility Policy
1.8
Compatibility
of Microlab Tools with 4" and 6" Substrates
1.9
VLSI Etchants
1.11 Miscellaneous
Plating Solutions
1.12 Material Safety Data Sheets (MSDS)
1.13 How to Write a
Lab Manual Chapter
1.14
1.15 Orientation
Notes
1.16 Laboratory
Guide
4.10 – Exposure
Tools
4.11 ASML DUV Stepper
Model 5500/90 (6”) (asml)
4.12 GCA 8500 Wafer
Stepper (6”) (gcaws6)
4.13 GCA 6200 Wafer
Stepper (4”) (gcaws2)
4.14 Karl Suss MA6
Mask Aligner (ksaligner)
4.15
Canon 4X
Projection Mask Aligner (canon)
4.16
Quintel Q4000 Mask
Aligner (quintel)
4.17
JEOL 6400 SEM & Nanometer Pattern Generation
System (jeol107)
4.18 Crestec CABL-9510CC High Resolution Electron Beam
Lithography System (crestec)
4.20 – Resist
Treatment
4.21 SVG 8626 Photoresist
Coat Track (6”) (svgcoat1)
4.22 SVG 8626 Photoresist
Coat Track (4”)
(svgcoat2)
4.23 SVGG-1 Photoresist
Coat Track (4”)
(svgcoat3)
4.24 SVG 8800 Coat
Track (6”) (svgcoat6)
4.25 SVGDEV Photoresist Development Tracks (4”) (svgdev)
4.26 SVG 8800
Develop Track (6”) (svgdev6)
4.27 UVBAKE –
Fusion M150PC Photostabilizer System (uvbake)
4.28 Matrix 106 Resist
Removal System (asher)
4.29 HMDS (Primeoven & Sink4 HMDS)
4.30 Headway Photoresist Spinner (spinner1)
4.40 – Others
4.41 Mix &
Match Process
4.42 Photomask Cleaning (sink12 photomask cleaning station)