Microlab Lab Manual

Table of Contents

Chapter 1 – General Information / Processing

1.1 Table of Contents

1.2 Chemical Hygiene Plan (Safety Rules & Procedures)

1.3 PROCESS MODULES:

· MOD 1 -14 (pdf)

· MOD 15 - 38 (html)

· Mems Exchange

1.4 CMOS Process (4", 1.3 µm)

1.5 CMOS Processes on 6” Wafers:

1.51 CMOS Process (1 µm)

1.52 CMOS Process (0.35 µm)

1.6 Substrate Specifications & Wafer Identification

1.7 Material & Process Compatibility Policy

1.8 Compatibility of Microlab Tools with 4" and 6" Substrates

1.9 VLSI Etchants

1.10 Miscellaneous Etchants

1.11 Miscellaneous Plating Solutions

1.12 Material Safety Data Sheets (MSDS)

1.13 How to Write a Lab Manual Chapter

1.14

1.15 Orientation Notes

1.16 Laboratory Guide

Chapter 2 - Cleaning Procedures

2.1 General Cleaning Procedures

2.2 Tystar and Lam Monitor Wafer Preparation and Rework

2.3 Sink3 Operation

2.4 Sink4 Operation

2.5 Sink5 (Y2)

2.6 Sink6 (MOS Clean)

2.7 Sink7 (VLSI)

2.8 Sink8 (Non-MOS Clean)

2.9 Sink9 Operation

2.10 Old Lab Sinks Operation (432C sink and black utility sink)

2.11 Sink 432A (Old Lab)

2.12 Sinkplate - Electroplating

2.13 Tousimis 815 Critical-Point Dryer (small samples)

2.14 Tousimis 915B Critical-Point Dryer

Chapter 3 - Mask Making

3.1 Mask Generation Using CAD Software

3.2 GCA Wafer Stepper Alignment Key Design Guide

3.3 GCA 3600 Pattern Generator

3.4 APT Emulsion Mask Process

3.5 APT Chrome Mask Process

3.6 Iron Oxide Masks Processing

3.7 Ultratech Mask Copier

3.8 CMOS Baseline Test Chip

Chapter 4 – Photolithography

4.00 – General Resist Parameters

4.10 – Exposure Tools

4.11 ASML DUV Stepper Model 5500/90 (6”) (asml)

4.12 GCA 8500 Wafer Stepper (6”) (gcaws6)

4.13 GCA 6200 Wafer Stepper (4”) (gcaws2)

4.14 Karl Suss MA6 Mask Aligner (ksaligner)

4.15 Canon 4X Projection Mask Aligner (canon)

4.16 Quintel Q4000 Mask Aligner (quintel)

4.17 JEOL 6400 SEM & Nanometer Pattern Generation System (jeol107)

4.18 Crestec E-Beam Lithography System (crestec) - Moved to Marvell Nanofabrication Lab

4.20 – Resist Treatment

4.21 SVG 8626 Photoresist Coat Track (6”) (svgcoat1)

4.22 SVG 8626 Photoresist Coat Track (4”) (svgcoat2)

4.23 SVGG-1 Photoresist Coat Track (4”) (svgcoat3)

4.24 SVG 8800 Coat Track (6”) (svgcoat6)

4.25 SVGDEV Photoresist Development Tracks (4”) (svgdev)

4.26 SVG 8800 Develop Track (6”) (svgdev6)

4.27 UVBAKE – Fusion M150PC Photostabilizer System (uvbake)

4.28 Matrix 106 Resist Removal System (asher)

4.29 HMDS (Primeoven & Sink4 HMDS)

4.30 Headway Photoresist Spinner (spinner1)

4.40 – Others

4.41 Mix & Match Process

4.42 Photomask Cleaning (sink12 photomask cleaning station)

Chapter 5 - Diffusion Furnaces/Ovens

5.0 Tystar/Tylan Furnaces Overview

5.1 Tystar1 MOS Clean Gate Oxidation Atmospheric Furnace (4" and 6")

5.2 Tystar2 MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6")

5.3 Tystar3 Non-MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6")

5.4 Tystar4 Non-MOS Clean Dry/Wet Oxidation and Anneal Atmospheric Furnace (4" and 6")

5.5 Tylan5 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric Furnace (4” Only)

5.6 Tylan6 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric Furnace (4” Only)

5.7 Tylan7 MOS Clean Gate/Dry Oxidation and Annealing Atmospheric Furnace (4” Only)

5.8 Tylan8 Compound Semiconductor Oxidation Furnace (1 cm Only)

5.9 Tystar9 MOS Clean Silicon Nitride (Si3N4) LPCVD Furnace (4" and 6")

5.10 Tystar10 MOS Clean Polycrystalline Silicon LPCVD Furnace (4" and 6")

5.11 Tystar11 MOS Clean LTO LPCVD Furnace (4" and 6")

5.12 Tystar12 Non-MOS Clean LTO LPCVD Furnace (4" and 6")

5.13 Tystar13 Non-MOS Clean POCl3 Doping Furnace (4" and 6")

5.14 Tystar14 Boron+ Doping Furnace

5.15 Tystar15 Non-MOS Polysilicon Carbide LPCVD Furnace

5.16 Tystar16 Non-MOS LPCVD Furnace

5.17 Tystar17 Non-MOS Low Stress Nitride and High Temperature Oxide LPCVD Furnace (4" and 6")

5.18 Tystar18 MOS Clean Aluminum Sintering Atmospheric Furnace (4" and 6")

5.19 Tystar19 MOS Clean Si-Ge LPCVD Furnaces (4" and 6" )

5.20 Tystar20 Non-MOS Clean Si-Ge LPCVD Furnace (4" and 6")

5.30 Contamination Monitoring of MOS-Clean Furnaces

5.31 Heatpulse1 - Rapid Thermal Annealing with Healpulse 210T RTA System

5.32 Heatpulse2 - Rapid Thermal Annealing with Healpulse 610T RTA System

5.33 Heatpulse3 - MOS Clean Rapid Thermal Annealing System

5.34 Heatpulse4 - MOS and Non-MOS Rapid Thermal Annealing System

5.35 Nanox Atmospheric Furnace for Growing Carbon Nanotubes

5.36 YES Vacuum Furnace (Polymide Curing and Annealing Furnace)

Chapter 6 - Thin Film Systems

6.00 – Sputterers

6.01 Hummer Sputtering System (for SEM samples ONLY)

6.02 Novellus m2i Sputtering System

6.03 Randex System

6.04 CPA Sputtering System

6.05

6.06

6.07 Edwards Auto 306 DC and RF Sputter Coater

6.08 AMS Aluminum Nitride

6.10 – Evaporators

6.11 NRC Evaporator

6.12 Veeco 401 Vacuum System

6.13

6.14 Edwards EB3 Electron Beam Evaporator

6.15 ULTEK E-Beam Evaporator

6.20 – CVD Thin Films

6.21

6.22 Parylene Deposition System 2010 Labcoter 2

6.23 AMST Molecular Vapor Deposition System MVD100

6.24 Picosun Atomic Layer Deposition (ALD)

6.25

6.26

6.27

6.28 P5000 MOS/Non-MOS Clean TEOS PECVD & ThCVD System (4" and 6")

6.29 Oxford Plasmalab 80plus PECVD System

6.30 Plasma Quest ECR PECVD System

6.31 Ion Beam Deposition System (4” and 6”) - Moved to Marvell Nanofabrication Lab

Chapter 7 - Etching Systems

7.0 Lam Etchers Overview

7.1

7.2 Lam2 Oxide Autoetcher

7.3 Lam3 Aluminum RIE Etcher

7.4 Lam4 Poly-Silicon Rainbow Etcher

7.5 Lam5 Poly-Si TCP Etcher

7.6 Centura^® MxP+ Chamber

7.7 Centura^® Deep Silicon Etch DPS-DT

7.8 STS Poly-Si ICP Etcher

7.9 Plasma-Therm Parallel Plate Etcher

7.10 Oxford RIE System (Restricted to CCH Group)

7.11 Technics C Plasma Etching System

7.12 Centura^® Metal Chamber

7.13 Xenon Difluoride Etching System

7.14 Ion Beam Milling with the Veeco Microetch System

7.15 Hfvapor (Idonus HF VPE-100 / 150)

Chapter 8 – Testing/Inspection Equipment

8.00 – Electrical Measurements

8.01 Four-Point Probe Resistivity Measurement

8.02 Surface Charge Analyzer (sca)

8.03 I-V Probe Station

8.04 General Probe Station

8.05 Electroglas Autoprobe in DCL

8.10 – Profilometers

8.11 Alpha-Step IQ Surface Profiler

8.12 Dektak Profilometer

8.13 Wyko NT3300 Profiling System

8.14 DI AFM Nanoscope Dimension 3100: Atomic Force Microscope

8.20 – Microscopes/Optical

8.21 Reichert Inspection Microscope

8.22 Linewidth Measuring System

8.23 UVScope

8.24 Memscope

8.25 Computer-Micro-Vision-System

8.30 – Thin Film Measurements

8.31 Rudolph Ellipsometer

8.32 Ellipsometer (sopra)

8.33 NanosSpec Film Thickness Measurement System

8.34 Nanometrics 210 XP Scanning UV - Nanospec/DUV Microspectrophotometer

8.35 FilmTek Thin Film Measurement

8.40 – E-Beam/X-Ray

8.41 JEOL 6400 SEM and Nanometer Pattern Generation System (same as 4.17)

8.42 Leo SEM

8.43

8.44 Siemens D5000 X-Ray Diffractometer

8.50 – Others

8.51 Sartorius A200S Electronic Analytical Balance

8.52 Flexus Thin Film Stress Measurement

8.53 Tensiometer (KSV Sigma 701)

8.54 Contact Angle Measurement System (Kruss)

8.55 FTIR In Situ Depth Monitoring System

Chapter 9 - Packaging

9.0 Bonding Tool Overview

9.1 Karl Suss BA6 Bond Aligner

9.2 Karl Suss SB6 Thermocompression and Anodic Bonder

9.3 Suss Microtech FC150 Flip Chip Bonder

9.4 Westbond Wirebonder Model 7400B

9.5

9.6 Esec 8003 Dicing Saw

Chapter 10 - Planarization

10.1 Chemical-Mechanical Polisher (CMP)

10.2 CMP Cleaning

Last Updated: 11/18/09