Special Equipment Recharge Rates
|
Short Name |
Long Description Name |
$ Cost/Unit
|
|
aln |
Adv.
Mod. Sputtering AMS-2003 |
0.56/min |
|
amst |
AMST
Molecular Vapor Deposition |
0.56/min |
|
asiq |
Tencor AS500 Profilometer |
0.56/min |
|
asml |
ASM
Lith. 5500/90 Stepper |
0.64/min |
|
canon |
Canon
4X wafer stepper |
0.56/min |
|
centura |
Centura deep silicon etch (centura-dps) |
0.64/min |
|
centura-met |
Centura DPS Metal Etcher |
0.56/min |
|
centura-mxp |
Centura Oxide Etcher |
0.64/min |
|
centura-stri |
Centura Stripper |
0.56/min |
|
cmp |
Strausbaugh CMP |
0.56/min |
|
cpa |
CPA
three-target sputterer |
59.00/use |
|
cpd |
Critical
Point Drying Apparatus |
0.56/min |
|
cpd2 |
Tousimis Critical Point Dryer |
0.56/min |
|
crestec |
Crestec E-Beam Writer |
2.17/min |
|
dektak |
Dektak Surface Profilometer |
0.64/min |
|
diebonder |
MEI
779 Die Bonder |
0.56/min |
|
disco |
Disco
DAD 2H/6 saw |
0.56/min |
|
dw |
Davis
& Wilder Evaporator |
0.56/min |
|
edwards |
Edwards
Sputter System |
0.56/min |
|
edwardseb3 |
Edwards
306 E-Beam System |
0.56/min |
|
flexus |
Tencor FleXus FLX2320 Stress Gauge |
0.56/min |
|
flipchip |
Suss FC150 |
0.56/min |
|
gartek |
Gartek sputterer |
59.00/use |
|
gcapg |
GCA
3600 pattern generator |
0.56/min |
|
gcaws |
GCA
6200 wafer stepper |
0.56/min |
|
gcaws2 |
GCA
G-Line 10X Wafer Stepper |
0.56/min |
|
gcaws6 |
GCA
8500 5X I-line |
0.56/min |
|
iondep |
Ion
Beam Deposition System |
0.56/min |
|
ionmill |
Veeco ion mill |
59.00/use |
|
jeol107 |
JEOL
6400 E-beam Writer |
0.56/min |
|
ksaligner |
Karl
Suss Mask/Bond Aligner |
0.56/min |
|
ksba6 |
Karl
Suss Bond Aligner |
0.56/min |
|
ksbonder |
Karl Suss Wafer Wafer Bonder |
0.56/min |
|
lam1 |
Lam
plasma etcher for nitride |
0.56/min |
|
lam2 |
Lam
plasma etcher for SiO2 |
0.56/min |
|
lam3 |
Lam
690 aluminum etcher |
0.56/min |
|
lam4 |
Lam
Research Rainbow 4400 |
0.56/min |
|
lam5 |
Lam
9400 TCP Poly Etcher |
0.56/min |
|
leo |
Leo
Scanning Electron Microscope |
0.64/min |
|
microvision |
Microvision Stroboscopic Microscope |
0.56/min |
|
nanotube |
Nanotube Furnace |
0.56/min |
|
nanox |
GaAs Oxidation & Nanotube |
59.00/use |
|
novellus |
Novellus
MI2 Sputterer |
0.64/min |
|
oxford |
|
59.00/use |
|
oxford2 |
|
0.56/min |
|
p5000 |
Applied
P5000 |
0.64/min |
|
parylene |
Specialty
Coating Systems PDS2010 |
0.56/min |
|
piii |
Plasma
Immersion Ion Implanter |
59.00/use |
|
plotter |
Hewlett
Packard Wide Plotter |
50.00/plot |
|
pqecr |
Plasma
Quest ECR PECVD |
0.64/min |
|
ptherm |
Plasmatherm reactive ion etcher |
0.56/min |
|
randex |
Randex sputtering system |
59.00/use |
|
sca |
Surface
Charge Analyser |
0.56/min |
|
semi |
Semigroup plasma etcher |
0.64/min |
|
sopra |
Sopra Variable Angle/Frequency Ellips |
0.56/min |
|
sts |
Surface
Technology Systems ICP Etcher |
0.56/min |
|
svgcoat1 |
SVG
8626/36 Coater Bake Front Track |
0.64/min |
|
svgcoat2 |
SVG
8626/36 Coat Rear Track |
0.64/min |
|
svgcoat3 |
SVG
8626/36 Coater Track |
0.64/min |
|
svgcoat6 |
SVG8800
Coat Track |
0.64/min |
|
svgdev |
SVG 8632 CTD Developer |
0.64/min |
|
svgdev6 |
SVG 8800 Develop Track |
0.64/min |
|
topgun |
s-gun
sputtering system |
59.00/use |