EECS 298-12
Solid State Technology and Devices Seminar
http://microlab.berkeley.edu/text/298-12.seminar/
Instructor: Professor T. King
also sponsored by
Profs. Bokor, Cheung, Hodges, Neureuther, Oldham,
Spanos, Subramanian,
and the Microlab
Fridays,
1:00 – 2:00 PM in the Hogan Room (521 Cory)
Date |
Speaker |
Company |
Host |
24 January |
Prof. T. KingSi Technology
in the 21st Century: Challenges and Opportunities |
EECS |
|
31 January |
Prof. Robert LeachmanSystematic Mechanisms Limited Yield in Semiconductor Manufacturing |
IEOR |
C. Spanos |
7 February |
Prof. Joseph StetterChemical Sensors and Arrays + Nano-Technology: Analytical Tools for the
Future
|
IIT |
T. King |
14 February |
Chi On ChuiSiGe MOSFET Technology |
Stanford |
V. Subramanian |
21 February |
Dr. H. LevinsonBig Challenges Facing Lithography |
AMD |
A. Neureuther |
28 February |
Dr. A. KolicsFormation of Passivation Layers on Copper Interconnects by Electroless Deposition |
Blue29, Inc. |
T. King |
7 March |
Leland ChangNanoscale Thin-Body Devices: From CMOS to MEMS |
EECS |
T. King |
14 March |
Dr. Dennis SinitskySemiconductor Technology Industry in the Foundry Age |
MoSys |
J. Bokor |
21 March |
Prof. E. JonesExploratory Materials for High-Performance Logic |
ECE/Oregon St. U. |
N. Cheung |
28 March |
No seminar, Spring Holiday |
||
4 April |
Prof. R. Wallace |
U. North Texas |
T. King |
11 April |
Dr. M. HankinsonLithography Process Control Challenges in High-Volume Manufacturing |
KLA-Tencor |
C. Spanos |
18 April |
Prof. G. P. LiMicro/Nano Technology Enabling Next Generation Multi-Function Integrated Systems in Telecommunication and Life Sciences Applications |
UC Irvine |
D. Hodges |
25 April |
Dr. Christoph JungemannHydrodynamic Simulation of RF Noise in SiGe HBTs and MOSFETs |
Stanford/CIS |
J. Bokor |
2 May |
Susie Tzeng, Ph.D. Candidate
Low-Frequency
Noise Spectroscopy of Semiconductor Devices |
MSE |
E. Weber |
9 May |
Dr. P. S. MartinHigh-Power Light
Emitting Diodes |
Lumileds Lighting |
T. King |
25 August |
Prof. L. LinRoom
Temperature Synthesized Silicon Nanowires and Carbon Nanotubes |
UCB/ME |
T. King |
5 September |
Prof. W. G. OldhamMaskless Lithography to 25 nm and Beyond or Can We Save EUV Lithography? |
EECS |
T. King |
12 September |
Dr. K. SrinivasanIntel’s Use of Advanced Process Control (APC) in Si Technology
Development
|
Intel, Portland |
C. Spanos |
19 September |
T. SondermanAdvanced Process Control in Semiconductor Manufacturing at AMD |
AMD |
C. Spanos |
26 September |
Dr. M. MeyyappanCarbon Nanotubes for Interconnects and Other Applications in Device Fabrication |
NASA AMES RC, Moffet |
J. Bokor |
3 October |
P. C. Ku, Ph.D. Candidate Semiconductor Slow-Light Device |
EECS |
C. Chang-Hasnain |
10 October |
Prof. S. CarterPower and Light from Plastics |
UC Santa Cruz |
V. Subramanian |
17 October |
Dr. G. BuneaHigh-Performance Silicon Solar Cells |
SunPower Corp. |
T. King |
24 October |
Dr. H. LuMicrofluidic Biomechanical and Electrical Devices for Rapid Analysis of Cells and Organelles |
UCSF |
T. King |
31 October |
Dr. D. GruppHigh-Performance Metal S/D MOSFETs |
Acorn Technologies |
T. King |
7 November |
Prof. A. DeHonSub-Lithographic Semiconductor Computing Systems – How Can We Build Nanometer Scale Computing Devices? |
Caltech |
J. Bokor |
14 November |
E. Anderson, A. LiddleNanoscience Through Nanofabrication with High-Resolution Electron Beam Lithography |
LBNL |
N. Cheung |
21 November |
Dr. A. FazioFlash Memory Technology: Multi-Level-Cell, Scaling, and Integration |
Intel |
V. Subramanian |
28 November |
No seminar – Thanksgiving Holiday
|
||
5 December |
K. L. ScottElectrical
Interconnect of Components Transferred by Fluidic Microassembly Using
Capillary Forces |
EECS |
T. King |