CSM-01: Competitive Semiconductor Manufacturing Survey: Results of the Pilot Phase. This document reports the results of the Pilot Phase of the Competitive Semiconductor Manufacturing (CSM) survey, a multi-year research program to study competitive semiconductor manufacturing worldwide. This report involves the measurement of manufacturing performance and investigation of underlying determinants of performance at 3 wafer fabrication facilities: Hewlett Packard, Corvallis, OR; NEC, Roseville, CA; Intel, Chandler, AZ. Metrics for measuring semiconductor manufacturing performance are proposed and illustrated for the participants. We also contrast managerial, organizational and technical factors underlying performance. (88 pages)
[CSM Title List]  [Purchase this Report]

CSM-02: The Competitive Semiconductor Manufacturing Survey: First Report on Results of The Main Phase. This document reports the results of the first 6 months of the Main Phase of the Competitive Semiconductor Manufacturing (CSM) survey. The survey is one component of a multi-year research program to study competitive semiconductor manufacturing worldwide. This report involves the measurement of manufacturing performance and investigation of underlying determinants of performance at 8 wafer fabrication facilities in the U.S. and Japan. The values of 7 technical metrics of semiconductor manufacturing performance are presented for the participants. We also compare and contrast managerial, organizational and technical practices underlying performance. (180 pages)
[CSM Title List]  [Purchase this Report]

CSM-03: Data Envelopment Analysis: Review of Standard Techniques, Interpretations, and Extensions. This paper provides an introduction to DEA, emphasizing the underlying technological assumptions, describing alternative interpretations, and providing some fundamental proofs. This paper also indicates how less restrictive assumptions lead to more computationally involved but still potentially tractable models. Finally, this paper describes some of the strengths and limitations of DEA, both in terms of its analytical capabilities and its current application. (63 pages)
[CSM Title List]  [Purchase this Report]

CSM-05: Database Design for the Competitive Semiconductor Manufacturing Program. The CSM Program has developed an electronic database to facilitate comparative research on data provided by the industrial participants of the study. This database has been implemented in the Ingres 6.4 relational database management system. A menu-based user interface has been developed for data input and retrieval; in addition, full query capability is provided through SQL interfaces. The current format of the database, its tables and attributes, and procedures for inputting and checking data are discussed. (64 pages)
[CSM Title List]  [Purchase this Report]

CSM-06: DORIC: Design of Optimized and Robust Integrated Circuit. This project investigates the application of the Robust Design Method to integrated circuit design using the HSPICE circuit simulator, and presents a design methodology to improve the manufacturability of integrated circuits. The developed computer-aided design tool DORIC allows the user to study the effect of certain design parameters (e.g., transistor sizes) and manufacturing variations (e.g., variations of oxide thickness) on specific circuit performance measures. Upon analyzing the results, the user can choose an optimal setting of the decision variables. (58 pages)
[CSM Title List]  [Purchase this Report]

CSM-07: The Statistics of In-Situ Particle Monitoring. In a processing step where a low-pressure environment is necessary, an in-situ particle monitor can be used to monitor particulate contamination. Data from an industrial survey, designed experiments, and several publications, show that a direct correlation between yield and particle counts has not been established. What has been established is that in-situ particle monitoring has evolved as a practical method of forecasting the need for maintenance. (14 pages)
[CSM Title List]  [Purchase this Report]

CSM-08: Competitive Semiconductor Manufacturing Survey: Second Report on Results of the Main Phase. This document reports the results of the first 18 months of the Main Phase of the Competitive Semiconductor Manufacturing (CSM) survey. The survey is one component of a multi-year research program to study competitive semiconductor manufacturing worldwide. This report involves the measurement of manufacturing performance and investigation of underlying determinants of performance at 16 wafer fabrication facilities in the U.S., the U.K., Germany, Japan and Taiwan. The values of 7 technical metrics of semiconductor manufacturing performance are presented for the participants. We also compare and contrast managerial, organizational and technical practices underlying performance. (138 pages)
[CSM Title List]  [Purchase this Report]

CSM-09: Competitive Semiconductor Manufacturing Human Resources Project: First Interim Report. The CSM Human Resources Project divided its research agenda into three major goals: (i) analysis of the data already collected (or to be collected) by the CSM Main Study, (ii) development of a supplemental mail-out questionnaire to fabs participating in the main study so that the employment and training structures could be documented and analyzed as a system; (iii) implementation of focus studies to analyze key questions on how the HR systems function. (132 pages)
[CSM Title List]  [Purchase this Report]

CSM-10: Semiconductor Yield Improvement: Results and Best Practices. The die yields and die yield improvement rates of 21 fabs are compared, and manufacturing yield improvement practices evaluated. Preliminary results of this continuing study indicate that die yield improvement is a function of computer-aided manufacturing practices and statistical process control practices in addition to commonly cited practices such as particle control and advanced manufacturing technology. (17 pages)
[CSM Title List]  [Purchase this Report]

CSM-11: Empirical Results on the Relationship Between Probe Yield and Cycle Time in Semiconductor Wafer Fabrication. A negative correlation between probe yield and cycle time is frequently hypothesized for semiconductor wafer fabrication. We perform a lot-by-lot analysis to probe yield and cycle time data from four volume manufacturing facilities. Our results indicate that the correlation is often statistically insignificant. (16 pages)
[CSM Title List]  [Purchase this Report]

CSM-12: Automated Incremental Production Planning Techniques for the Semiconductor Industry. We propose techniques and algorithms to add incremental planning capabilities to existing batch production planning systems within the semiconductor industry. Implementation results for one such system to incrementally plan custom demands are provided. Methodology for another incremental planning system incorporating both demand and supply changes is also described. (39 pages)
[CSM Title List]  [Purchase this Report]

CSM-13: Collaborative Gains and Hazards in the Technology Sourcing Decision. In the US semiconductor industry, one sees the recent emergence of sourcing relationships in which chip designers and manufacturers enter co-development arrangements with suppliers where the concern seems anything but the protection of assets. In this paper, the fundamental requirements of technological co-development activity are explained and the variables which drive these new organizational forms are exposed. (68 pages)
[CSM Title List]  [Purchase this Report]

CSM-14: Technology Sourcing and the Boundaries of the Firm. This paper draws upon insights from evolutionary economics, agency theory and transaction cost to develop a vertical governance model and four industry-specific shift factors that explain the transitions of US semiconductor firms in organizing and sourcing their semiconductor component packaging activities and technologies. (54 pages)
[CSM Title List]  [Purchase this Report]

CSM-15: Learning Through Technology Partnerships in Semiconductor Component Packaging. This paper documents and contrasts the knowhow development activities of a US firm and its Japanese partner during a 5-year "packaging" technology co-development partnership in the semiconductor industry. It demonstrates how a general methodology, referred to as a knowhow asset framework, can be used to quantify and value the proprietary technology or knowhow that a firm accumulates through its participation in the partnership. (41 pages)
[CSM Title List]  [Purchase this Report]

CSM-16: Components of the Learning Curve in Semiconductor Fabrication Processes. This paper investigates the problem-solving activities and technical measurements used by 10 leading semiconductor companies worldwide to benchmark and improve the productivity of 29 processes used to produce advanced semiconductor logic products such as ASICs and microprocessors. The behavior of two very different kinds of learning activities are discussed: (1) Operator-based Learning by Repetition and (2) Engineering-based Learning by Problem-Solving. (41 pages)
[CSM Title List]  [Purchase this Report]

CSM-17: Assessing Best-in-Class Performance of Semiconductor Manufacturers. This report describes a data analysis technique for assessing best-in-class performance that simultaneously takes into account labor, equipment, good silicon volume, cycle time and fab capacity. The technique is applied to Competitive Semiconductor Manufacturing Survey data to identify best-in-class performance levels for each participating fab. (29 pages)
[CSM Title List]  [Purchase this Report]

CSM-18: Production Planning and Scheduling Practices Across the Semiconductor Industry. This report surveys production planning and scheduling practices across the semiconductor industry. Rather than attempt a cross-sectional analysis of the entire industry, an effort has been made to include leading-edge practices in the sense of excellent on-time delivery or cycle time performance as well as in the sense of analytical or computerized sophistication. This report focuses on practices for operational planning, which concerns the quotation of delivery dates to prospective customers and the determination of factory start and factory out schedules. (30 pages)
[CSM Title List]  [Purchase this Report]

CSM-19: Benchmarking Manufacturing Performance in the Semiconductor Industry. A methodology for benchmarking manufacturing practices in the world-wide semiconductor industry is presented. Several metrics for measuring semiconductor manufacturing performance are defined and discussed. Methods of identifying the managerial, technical and organizational practices underlying superior metric performance are identified through the use of site visits. (24 pages)
[CSM Title List]  [Purchase this Report]

CSM-20: Participative Management: An Analysis of the Semiconductor Manufacturing Industry. This paper shows that a particular participative management program will drive only a limited number of basic elements at the lower levels of wafer fabrication. It is not uncommon to see a set of multiple participative management programs practiced by a single fab. This paper concludes that the same efficiency of operation can be achieved by a fab by deploying a different combination of the participative management approaches within a fab. (23 pages)
[CSM Title List]  [Purchase this Report]

CSM-21: Closed-Loop Measurement of Equipment Efficiency and Equipment Capacity. Formal definitions for the components of efficiency and capacity, mathematical formulas for computer overall efficiency, and data collection strategies are proposed for rigorous measurement of equipment efficiency and capacity. Applications in semiconductor factories are discussed. (27 pages)
[CSM Title List]  [Purchase this Report]

CSM-22: A Systems View of Work Group Performance: An Example from Semiconductor Manufacturing. This focus study uses a recently developed model of work group performance to analyze performance of a production work group at a North American semiconductor manufacturing facility. The model incorporates a systems view and utilizes data on group-member knowledge, skills and abilities (KSA) to produce a useful characterization of the work system. (33 pages)
[CSM Title List]  [Purchase this Report]

CSM-23: Empirical Techniques for Analyzing Organizations: An Examination of the Semiconductor Industry. Using performance and organizational data collected for the Competitive Semiconductor Manufacturing Study, this dissertation examines the following difficulties of organizational studies: (i) benchmarking performance, (ii) model testing, and (iii) exploratory data analysis. (153 pages)
[CSM Title List]  [Purchase this Report]

CSM-24: IMPReSS: An Automated Production Planning and Delivery Quotation System at Harris Corporation - Semiconductor Sector. This paper explores IMPReSS (Integrated Manufacturing Production Requirements Scheduling System), a large-scale, optimization-based global production planning system implemented at Harris Corporation - Semiconductor Sector. (43 pages)
[CSM Title List]  [Purchase this Report]

CSM-25: Development and Use of In-Line Yield Estimates in Semiconductor Manufacturing. This dissertation investigates the development of information necessary for the in-line estimation of yield, and assesses the potential of such information to meaningfully influence production control decision-making. While a common industry assumption is that low yield is the result of long cycle times, an analysis of extensive industrial data using statistical correlation models concludes that yield and cycle time of the same lot are essentially unrelated. (172 pages)
[CSM Title List]  [Purchase this Report]

CSM-26: Production Planning and Scheduling for Semiconductor Device Testing. In this dissertation, the semiconductor device testing process is analyzed and modeled. The goal is to accurately model the capacity of the final test stage of semiconductor manufacturing for long-term planning models, and to find good short-term scheduling strategies for this complex production environment. Several simplified versions of the test-floor scheduling problem are identified as well-known combinatorial optimization problems. The general multi-head tester scheduling problem is then formulated, and a computerized enumeration procedure that determines the highest value schedule is presented. (200 pages)
[CSM Title List]  [Purchase this Report]

CSM-27: Benchmarking Semiconductor Manufacturing. This article is based on data and analysis drawn from a continuing study on the manufacturing performance of semiconductor wafer fabrication plants in the US, Asia and Europe. There are great similarities in production equipment, manufacturing processes and products produced at these plants. Nevertheless, data reported here show that important quantitative measures of productivity vary by factors of 3 to as much as 5 across an international sample of 16 plants. (26 pages)
[CSM Title List]  [Purchase this Report]

CSM-28: Process Innovation and Learning by Doing in Semiconductor Manufacturing. This paper examines one of the most important firm-specific capabilities for competition in the semiconductor industry: the ability of firms to develop, introduce and expand production with new processes. A firm that is slow to expand the output of a new product, or introduces a new product with a poorly characterized manufacturing process, faces severe cost and profit penalties. (38 pages)
[CSM Title List]  [Purchase this Report]

CSM-29: Investment in Learning Capital: Enhancing the Rate of Learning in Semiconductor Manufacturing. In this paper, a set of physical and human capital factors is identified that enhances the rate of learning by doing in the semiconductor industry. Physical capital variables include investment in new processing equipment and information systems. Investments in human capital transform laborers into problem solvers, increasing the level of learning by doing activities. (35 pages)
[CSM Title List]  [Purchase this Report]

CSM-31: Competitive Semiconductor Manufacturing Survey: Third Report on the Results of the Main Phase. This document reports the results of the first 3.5 years of the Main Phase of the Competitive Semiconductor Manufacturing (CSM) survey. The survey is one component of a multi-year research program to study competitive semiconductor manufacturing worldwide. This report involves the measurement of manufacturing performance and investigation of underlying determinants of performance at 28 wafer fabrication facilities in the U.S., the U.K., Germany, Spain, Japan, Korea and Taiwan. The values of 10 technical metrics of semiconductor manufacturing performance are presented for the participants. We also compare and contrast managerial, organizational and technical practices underlying performance. (232 pages)
[CSM Title List]  [Purchase this Report]

CSM-32: The Competitive Semiconductor Manufacturing Human Resources Project: Second Interim Report. The CSM Human Resources project has three research activities: (i) analysis of the data previously collected on fifteen fabs by the CSM main study; (ii) development, collection, and analysis of a supplemental mail-out HR questionnaire to participating fabs about their employment (i.e., human resources) and training systems; (iii) analysis of key questions, or focus studies, on how the HR systems function. (264 pages)
[CSM Title List]  [Purchase this Report]

CSM-33: Learning Effects in Semiconductor Fabrication. This paper examines learning-by-doing in the context of semiconductor fabrication. Our analysis is based on questionnaire data obtained from semiconductor fabrication facilities. Based on empirical estimates for yield improvements, we simulate learning curves, i.e., cost curves, for a representative process. (29 pages)
[CSM Title List]  [Purchase this Report]

CSM-34: An Evolutionary Approach to Inter-firm Innovation: A Study of a US-Japanese Semiconductor Partnership. This paper argues that first-order internal organizational routines--control, replication, contraction, imitation--can not by themselves generate enough "variety" to meet the conditions of a technologically dynamic and time-critical environment. It proposes that the increased frequency of inter-firm arrangements, collaborations and networks in technologically dynamic and time-critical environments can be theoretically viewed as the adaptive evolutionary response of firms to generate "direct variety" and innovation through second-order externally oriented organizational routines. (35 pages)
[CSM Title List]  [Purchase this Report]

CSM-35: Adaptive In-line Sampling Strategies for Semiconductor Manufacturing. This focus study is intended to develop an adaptive sampling strategy which can dynamically adjust four sampling parameters, namely where to sample, number of lots, wafers per lot, and wafer area coverage. Two different sampling strategies are discussed: (i) a statistical process control (SPC) chart based approach, and (ii) a dynamic programming based approach. This preliminary study addresses single layer sampling problems. Multi-layer sampling problems are under further study. (36 pages)
[CSM Title List]  [Purchase this Report]

CSM-36: Optimizing Fab Scheduling in the Face of Uncertainty. Wafer fab production management must cope with uncertainties in yields and in equipment performance. A stochastic dynamic programming model has been developed for scheduling new lot releases and for allocating bottleneck photolithography resources so as to rebalance work-in-process. (4 pages)
[CSM Title List]  [Purchase this Report]

CSM-37: Managing the Development and Transfer of Process Technologies in the Semiconductor Manufacturing Industry. This paper discusses the importance of the successful development and introduction of new manufacturing processes for competitive performance in the semiconductor industry, and presents data that characterize some of the consequences of poor performance in this activity. Case studies provide a more detailed firm-level view of the activities that underpin the development and introduction of new manufacturing processes in the industry. (36 pages)
[CSM Title List]  [Purchase this Report]

CSM-38: The Competitive Semiconductor Manufacturing Human Resources Project: The Final Report (Phase I). M. Appleyard, N. Hatch, D. Mowery (Haas School of Business) (May 1997) This report is available on the web in it's entirety. Please click here to view the report on-line.
[CSM Title List]

CSM-39: After-Sales Service and Support Provided by the Semiconductor Equipment Industry. This report presents the findings of a twelve-month (June, 1995 - June, 1996) study of after-sales service and customer support provided by semiconductor equipment vendors to manufacturers of semiconductor devices. The study focused on service and support practices for four specific categories of semiconductor manufacturing equipment. We surveyed practices and costs of after-sales service and support at three to five companies marketing equipment in each category. The categories of equipment surveyed were: Plasma etching systems, Photolithography resist coating and developing systems, Wafer inspection systems, and Test systems for logic devices. (54 pages)
[CSM Title List]  [Purchase this Report]

CSM-40: National Performance in Semiconductor Manufacturing. The Competitive Semiconductor Manufacturing Program at U.C. Berkeley has collected statistics on technical performance of wafer fabrication facilities operated by leading semiconductor companies around the world. In this paper, we report fab performance statistics for the period 1989-95 averaged by nation or region, specifically, USA, Japan, Korea, Taiwan and Europe. For most technical metrics of interest (defect density, line yield, 5X stepper throughput, cycle time), a large lead enjoyed by fabs located in Japan during the beginning of the decade had eroded away by late 1993 or early 1994, as fabs located in Korea, Taiwan and USA began achieving comparable performance. (32 pages)
[CSM Title List]

CSM-41: Field Study of Overall Equipment Efficiency (O.E.E.) Measurement of 5X Steppers.  This paper introduces the concepts of Overall Equipment Efficiency (OEE) and how OEE is applied to real fab manufacturing equipment, specifically G-Line 5X steppers. First, we describe the photolithography process and the wafer processing cycle in a Canon G-Line 5X stepper. Next, we formulate the production time of a 5X stepper and apply the production time to OEE analysis. Details of the application are presented and major sources of equipment efficiency losses are discussed. Guided by the calculations of this OEE application, one wafer fab improved the average throughput of the 5X steppers by 275% over a 12-month period.
[CSM Title List]  [Purchase this Report]

CSM-42: Productivity Metrics for Flexible-Sequence Cluster Tools. This paper presents a set of productivity metrics suitable for evaluating a special class of semiconductor manufacturing equipment, which we call flexible-sequence cluster tools. For this class of tools, equipment control systems make spontaneous decisions about allocating system resources. Within the tool, there are typically several alternative resources to choose from, e.g. multiple process chambers capable of performing the same processing operations. Consequently, resource sequences for these tools are complicated and difficult to predict. Determining the most efficient allocation of resources require the use of simulation or critical path optimization (47 pages)
[CSM Title List]  [Purchase this Report]

CSM-43: Performance and Innovation in the U.S. Semiconductor Industry, 1980-1996.  This paper surveys the wide swings in competitive performance of U.S. semiconductor firms in the global semiconductor industry from 1980 to 1996.  For most of the industryís history, U.S. semiconductor producers were undisputed leaders in market share, product introduction, and process technology advance, but they lost this dominant position during the early 1980s.  After enduring significant market share losses, U.S. semiconductor firms and the federal government took corrective actions on several fronts.  A concerted effort in improving product quality and manufacturing process yields narrowed the gaps between them and foreign competitors.  U.S. firms also exited from product lines in which their historic skills at product innovation provided limited competitive advantage.  Federal government initiatives, ranging from trade policy to financial support for university research and R&D consortia such as SEMATECH, also played a role of uncertain magnitude in the industryís revival.  The resurgence of the industry is an impressive feat, but the unexpected nature of this revival, its complex causes, and the fragility of its foundation, suggest that U.S. semiconductor firm strength cannot be taken for granted. (65 pages)
[CSM Title List]  [Purchase this Report]

CSM-44: Models of Theoretical and Average Process Times for Selected Semiconductor Fabrication Equipment.  This document presesnts models of selected semiconductor manufacturing equipment for the purposes of determining theoretical and average processing times by recipe. Theoretical processing times are necessary components in the computation of overall equipment efficiency (OEE), rate efficiency, and quality efficiency, whereas average processing times are necessary for planning and scheduling. As asserted in Leachman [1997], these two distinct times can and should be derived from the same database. (95 pages)
[CSM Title List]  [Purchase this Report]

CSM-45: Proposed Revision to SEMI's Standard for Definition and Measurement of Equipment Productivity.  As representatives of the Competitive Semiconductor Manufacturing research program from the University of California, Berkeley, we are serving on the SEMI Task Force for the measurement of equipment productivity and have made contributions to the original standard. In this document, we are proposing a number of major changes to E79 in order to make it a more complete and more accurate standard for the measurement of equipment productivity. These changes have been approved by the Task Force, and it is anticipated that a ballot seeking approval of a revision to E79 incorporating these changes will be distributed to SEMI membership in Fall, 1999. (28 pages)
[CSM Title List]  [Purchase this Report]

CSM-46: Automated Procedures for Characterizing Specific Equipment Productivity Losses with Applications in the Semiconductor Manufacturing Industry.  This dissertation develops techniques and procedures for characterizing specific productivity losses of complex manufacturing equipment. Cases are taken from the semiconductor industry, and procedures are developed for its particular needs. Based on a survey of improvement paradigms, indutry standards, and data technology, it is generally concluded that although ample diagnostic technology exists, standard procedures or techniques do not seem to be universally understood nor applied, especially to the problem of characterizing equipment rate efficiency losses. To help fomalize equipment productivity measurement, techniques are presented for modeling equipment processing sequences as activity-on-node networks of operational elements, where sequence duration and path slack for elements may by determined using ordinary critical path calculations... (194 pages)
[CSM Title List]  [Purchase this Report]

CSM-47: Understanding Fab Economics.  The performance of wafer fabrication facilities, ususally referred to simply as 'fabs', has traditionally been evaluated using such operational metrics as yield, wafer throughput, equipment utilization, process development time, and cycle time. This has led to lengthy and often nonprodcutive debates as to how to optimize fab productivity using these performance measures. We suggest that this discussion be redirected using the generally accepted metric, dollars. In this report we intorduce two economic models that together provide a unified approach to assessing fab productivity. (94 pages)
[CSM Title List]  [Purchase this Report]  [Download 'Fab Expense and Delay Cost Models']

CSM-48: Trends in Worldwide Semiconductor Fabrication Capacity. We estimate capacity for 1,175 fabs worldwide. At the start of 1998, worldwide fab capacity amounted to 1,100 quadrillion electrical functions per month. Since the late 1980s, capacity has grown fairly steadily at an average of 32 percent per year, with the notable exception of 1995, during which it grew by 55 percent. In this report we extrapolate and predict that excess capacity will subside between late 2000 and early 2002. In terms of factory locations as of 1998 we consider the trends and predict that in five years' time, perhaps half of world capacity will be located in the Asia Pacific region. We identify key reasons for the concentration of fab capacity in the Asia Pacific region. (25 pages)
[CSM Title List]  [Purchase this Report]
 

CSM-49: Mathematical Optimization of Semicondutor Production Planning. The planning of semiconductor manufacturing presents formidable challenges for the successful application of mathematical optimization. Formulation techniques are described that precisely model non-integer flow times, time-phased capacity consumption by re-entrant process flows, proper horizon behavior, multiple priority classes of demands and multiple objectives, binning and substitution in product structures, and arbitrary distributions of initial work-in-process. We also formulate exact capacity analyses of non-homogenious resources, machine arrangement constraints, and alternative combinations of resources necessary to execute manufacturing operations. Brief histories are provided of key modeling contributions and of optimization applications to production planning in the industry. (20 pages)
[CSM Title List]  [Purchase this Report]

CSM-50: E-Commerce and the Changing Terms of Competition in the Semiconductor Industry. Traditionally, the semiconductor industry has consisted mostly of integrated firms that carry out the design, manufacture and marketing of integrated circuit products. A large portion of the industry is re-structuring into so-called "fabless" and "foundry" firms. Foundries offer a contract manufacturing service, fabricating semiconductor products designed and marketed by others. Fabless firms carry out design and marketing of integrated circuits, but choose to out-source some or all of their manufacturing to the foundries. By curtailing investments in fabrication capacity and out-sourcing manufacturing to the foundries, an integrated fim can become increasingly fabless.(34 pages)
[CSM Title List]  [Purchase this Report]

CSM-51: Learning by Using in Semiconductor Manufacturing: The Role of Local Information and Problem Solving Capabilities. This dissertation studies learning-by-using: the learning derived from using specialized processing equipment within an actual manufacturing context, which results in improved manufacturing efficiency, capability, and effectiveness. I argue that learning-by-using stems from engineering effort that results in increased knowledge about the equipment itself, operating procedures, control software, organizational structure, operations management and system integration. The analysis contributes to Zangwill and Kantor's (1998) theory of the learning curve and continuous improvement, von Hippel and Tyre's (1995) work on information "stickiness" and user innovation, Jaikumar and Bohn's (1986) conceptual framework of technological knowledge, and Rosenberg's (1982) analysis of learning-by-using. (301 pages)
[CSM Title List]  [Purchase this Report]

CSM-52: Competitive Semiconductor Manufacturing: Final Report on Findings from Benchmarking Eight-inch, sub-350nm Wafer Fabrication Lines. This report summarizes findings from benchmarking ten fabrication plants processing eight-inch silicon wafers to fabricate digital devices with feature sizes of 350nm and smaller. The report provides technical metrics of manufacturing performance and a discussion of key practices that underlie leading performance. Familiar technical metrics are presented measuring performance along the dimensions of yield, equipment throughput, labor and space productivity, and cycle time. Trade-offs between performances in these dimensions are illustrated, and an economic interpretation is developed of the gap between average and benchmark performance. (96 pages)
[CSM Title List]  [Purchase this Report]

Last updated 04/11/02 by John Tast